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Headset earmuff with adsorbent material

A technology for headphones and earmuffs, which is applied to on-ear/around-ear headphones, earpieces/headphone accessories, sensor parts, etc., and can solve the problems of reducing the user's sense of openness and sound quality

Pending Publication Date: 2022-04-01
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These standing waves can degrade sound quality and reduce the sense of openness that users typically expect
Open back earcups, on the other hand, may feel more open to the user, but may not be ideal in loud environments as they may not passively attenuate as well as closed back designs

Method used

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  • Headset earmuff with adsorbent material
  • Headset earmuff with adsorbent material
  • Headset earmuff with adsorbent material

Examples

Experimental program
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Embodiment Construction

[0016] The following description shows numerous specific details. However, it is understood that aspects of the disclosure may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description.

[0017] In the following description, reference is made to the accompanying drawings that illustrate several aspects of the disclosure. It is to be understood that other aspects may be utilized, and mechanical compositional, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be read in a limiting sense, and the scope of aspects of the present disclosure is defined only by the claims of the issued patent.

[0018] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be li...

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PUM

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Abstract

The present invention discloses a headphone earmuff, the headphone earmuff comprising: a frame defining an acoustic cavity acoustically coupled to a driver; an earmuff cushion coupled to the frame and surrounding the acoustic cavity; and a sorbent member acoustically coupled to the acoustic cavity to cause acoustic enlargement of the acoustic cavity.

Description

[0001] Cross References to Related Applications [0002] This application is a non-provisional application of co-pending US Provisional Patent Application 63 / 079,389, filed September 16, 2020, and is incorporated herein by reference. technical field [0003] One aspect of the present disclosure relates to headphone earmuffs, and more particularly to headphone earmuffs having absorbent material to acoustically expand the sound cavity of the earmuffs. Other aspects are also described and claimed. Background technique [0004] Whether listening to a portable media player while traveling or listening to a stereo or theater system at home, consumers often choose headphones. Headphones typically include a pair of ear cups that surround the user's ears and are held together by a headband. Based on the design of the ear cups, headphones can be classified into two categories, closed back ear cups or open back ear cups. Closed-back earcups surround the user's ear and the back of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1008H04R1/1091H04R1/288H04R5/0335H04R1/2811H04R1/2803H04R1/1083H04R2201/029H04R1/1058
Inventor C·维尔克J·B·拉格勒
Owner APPLE INC