Storage structure for tape packaging and carrying disc thereof
A structure and storage technology, which is applied to the storage structure of the wire part and the field of the carrier plate, can solve disadvantages and other problems, and achieve the effect of the wire part being flat
Active Publication Date: 2022-04-08
CHIPBOND TECH
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- Description
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- Application Information
AI Technical Summary
Problems solved by technology
[0002] The existing conventional tape and reel packaging process is to arrange a plurality of chips on the flexible substrate and cut them at the end of the process to form a plurality of tape and reel packages with an electronic component part and a lead part. However, due to various The flexible substrate is made of materials such as polyimide (Polyimide, PI), so after the cutting step, the wire part of each tape package will be warped, and each tape with warped wire part package that would not facilitate being bonded to another electronic component
Method used
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Embodiment Construction
[0054] see figure 1 , figure 2and image 3 , a tape and reel packaging storage structure 100 of the present invention, which is used to store a plurality of tape and reel packages 10 ( see Figure 8 ), the tray structure 100 at least includes a first tray 110 and a second tray 120, the second tray 120 is stacked on the first tray 110, the tape and reel package 10 is placed on the first Between the tray 110 and the second tray 120 (see Figure 7 ).
[0055] see figure 1 , image 3 and Figure 4 , the first tray 110 has a plurality of first accommodating units 110a, each of the first accommodating units 110a is used to accommodate each of the tape and reel packages 10, in this embodiment, each of the first accommodating units 110a It has a first base 111, a plurality of first supporting ribs 112 and a first accommodating groove 113, the first supporting ribs 112 surround the first accommodating groove 113, and the first base 111 is located in the first accommodating gro...
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The invention relates to a storage structure for tape packaging and a carrying disc thereof. The storage structure for the tape package is used for storing a plurality of tape packages provided with electronic element parts and two wire parts respectively tilted at two sides of the electronic element parts, and pressing the tilted wire parts, the storage structure comprises a first carrying disc and a second carrying disc, the first carrying disc is provided with a plurality of first accommodating units, and the second carrying disc is provided with a plurality of second accommodating units. The first carrying disc is provided with a plurality of first containing units, the first containing units are used for containing the winding tape packages, the second carrying disc is arranged on the first carrying disc in an overlapped mode, the second carrying disc is provided with a first touch pressing part and a second touch pressing part, and the first touch pressing part and the second touch pressing part are used for respectively touching and pressing the wire parts tilting towards the second carrying disc so as to change the warping radian of the wire parts. Therefore, the wire parts are relatively flat.
Description
technical field [0001] The present invention relates to a storage structure for tape and reel packaging and its carrier, in particular to a storage structure and its carrier for pressing the wire portion of the tape and reel package. Background technique [0002] The existing conventional tape and reel packaging process is to arrange a plurality of chips on the flexible substrate and cut them at the end of the process to form a plurality of tape and reel packages with an electronic component part and a lead part. However, due to various The flexible substrate is made of materials such as polyimide (Polyimide, PI), so after the cutting step, the wire part of each tape package will be warped, and each tape with warped wire part package that would not facilitate being bonded to another electronic component. Contents of the invention [0003] The main purpose of the present invention is to change the warping radian of each lead portion by touching and pressing the warped lead...
Claims
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IPC IPC(8): B65D73/00B65D73/02
CPCH05K1/189H05K13/0069H01L23/32H01L21/67333H01L21/6735H05K1/0277H05K2201/09036H05K1/14
Inventor 张世杰黄惠愈彭智明李俊德
Owner CHIPBOND TECH