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Cooling system

A technology for cooling systems, buffer units, used in cooling/ventilation/heating retrofits, modifications with gaseous coolants, electrical components, etc., to solve problems such as reduced server reliability

Pending Publication Date: 2022-07-12
BAIDU USA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Servers used in data centers are less reliable if the operating environment allows the temperature to increase over time

Method used

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  • Cooling system
  • Cooling system
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Embodiment Construction

[0035] Various embodiments and aspects of the present disclosure will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings illustrate the present disclosure and are not to be construed as limiting the present disclosure. Numerous specific details are described to provide a thorough understanding of various embodiments of the present disclosure. However, in some instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present disclosure.

[0036] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The appearances of the phrase "in one embodiment" in various places in the specification are not necessaril...

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Abstract

A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices; a main loop; and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, where the heat exchanger is configured to receive the fluid from the inlet port, exchange heat generated by the electronic device and carried by the fluid, and return the fluid to the electronic device via the outlet port. The buffer loop is coupled to the inlet port and the main loop. The buffer loop includes a buffer unit and a first valve to control fluid flow into the buffer unit for storage and discharge fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit includes an air portion for storing air and a buffer portion for storing a portion of the fluid. The air portion is used to regulate the air pressure based on a temperature obtained from a temperature sensor disposed on the heat exchanger and a fluid pressure obtained from a pressure sensor disposed near the inlet port.

Description

technical field [0001] Embodiments of the present invention generally relate to data center cooling. More specifically, embodiments of the present invention relate to a buffer unit design for cooling electronic equipment such as data centers, IT, and servers. Background technique [0002] Cooling is an important factor in the design of computer systems and data centers. The number of high-performance electronic components, such as high-performance processors packaged inside servers, has steadily increased, increasing the amount of heat generated and dissipated during normal operation of servers. If the operating environment permits temperature to increase over time, the reliability of the servers used in the data center decreases. Maintaining a proper thermal environment is critical to the proper operation of these servers in the data center, as well as server performance and longevity. More efficient and efficient cooling solutions are needed, especially in cooling these...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20763H05K7/20718H05K7/20836H05K7/20781H05K7/20272H05K7/20163H05K7/20209H05K7/20254H05K7/20281
Inventor 高天翼
Owner BAIDU USA LLC