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Apparatus and method for substrate handling

A technology for substrates and equipment, which is applied in the field of semiconductor equipment and equipment for substrate processing, and can solve problems such as satisfaction

Pending Publication Date: 2022-07-29
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although existing equipment for handling semiconductor substrates is generally adequate for its intended purpose, it is not yet fully satisfactory in all respects

Method used

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  • Apparatus and method for substrate handling
  • Apparatus and method for substrate handling
  • Apparatus and method for substrate handling

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Embodiment Construction

[0021] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description forming a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which the first feature is formed Embodiments in which additional features may be formed between and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may reuse reference numbers and / or letters in various instances. This re-use is for the purpose of brevity and clarity and is not itself indicative of the relationship between the various embodiments and / or configura...

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Abstract

An apparatus and method for handling a semiconductor substrate. The apparatus includes a chuck table and a first flexible member. The chuck table includes a bearing surface, a first recess in the bearing surface, and a vacuum conduit disposed below the bearing surface, and is configured to hold a semiconductor substrate. A first flexible member is disposed within the first recess and includes a top surface protruding from the first recess, the first flexible member being compressed when the semiconductor substrate is pressed against the first flexible member.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor device and method of use, and more particularly, to a semiconductor device device and method of use for substrate handling. Background technique [0002] Most integrated circuits are fabricated on semiconductor substrates by sequentially forming layers and structures of various materials over previously formed layers and structures. Due to the different coefficients of thermal expansion (CTE) of different materials, the thermal expansion problem during the fabrication process may lead to warpage of the semiconductor substrate. Therefore, there is an ongoing effort to develop new mechanisms to control warpage behavior to form semiconductor substrates with better performance. Although existing equipment for handling semiconductor substrates is generally adequate for its intended purpose, it is not yet fully satisfactory in all respects. SUMMARY OF THE INVENTION [0003] According to some ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838H01L21/68735H01L21/67126H01L21/67288
Inventor 廖仁骏吴松岳黄见翎谢静华
Owner TAIWAN SEMICON MFG CO LTD