Semiconductor device

A semiconductor and device technology, applied in the field of high-performance semiconductor devices, can solve problems such as voltage drop of semiconductor chips that cannot be solved, and achieve the effect of increasing the number of connection terminals, reducing voltage drop, and improving installation efficiency
CN1359154AInactive Publication Date: 2002-07-17KK TOSHIBA
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
KK TOSHIBA
Publication Date
2002-07-17
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

A semiconductor device is disclosed, which comprise a first semiconductor chip where a semiconductor element is formed, a first connecting terminal arranged on a semiconductor element formation surface side in the first semiconductor chip and connected electrically to the semiconductor element, a conductive member buried in a through hole that goes through the first semiconductor chip, a second connecting terminal arranged on a back surface side of the semiconductor element formation surface in the first semiconductor chip, and connected electrically to the semiconductor element via the conductive member, a wiring substrate to which the first semiconductor chip is mounted, and a third connecting terminal at least portion of which is formed at a position corresponding to one of the first connecting terminal and the second connecting terminal, and which is electrically connected to the one of the first connecting terminal and the second connecting terminal.
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Description

technical field

[0001] The present invention relates to a semiconductor device with a packaging structure in which through holes for embedding conductive components are formed in a semiconductor chip, and wiring is drawn out from the formation surface side and the back side of the semiconductor element, especially a high-performance semiconductor device with enhanced power supply. Background technique

[0002] With the reduction of power supply voltage and the increase of circuit scale accompanying the refinement of semiconductor integrated circuits, the size of semiconductor chips has been increased, and the problem of voltage drop inside the semiconductor chip has become prominent. As a countermeasure against this, a package of a flip-chip structure in which connection terminals are provided across the entire surface of a semiconductor chip and connected face down on a multilayer wiring board is becoming mainstream.

[0003] Figure 29 is a cross-sectional view showing a s...

Claims

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