Cutting making process of silicon carbide boat for chip manufacture

Abstract

The linear cutting process for manufacturing carborundum boat for making wafer includes the following steps: (1). cutting carborundum tube to obtain blank material; (2) cutting blank to form and combing to produce comb gap; (3) cleaning primary product for several times, its cleaning liquor includes detergent, chlorylene, sulfuric acid and hydrogen peroxide, fluohydric acid and pure water, etc.; (4). annealing, heat treatment; (5) secondary cleaning; (6) polishing primary product by adopting oxyhydrogen H2O2; (7) more annealing heat treatment for eliminating stress produced by polishing step;(8). further cleaning; and (9) projecting and detecting primary product to obtain the invented finished product.

Description

technical field

[0001] The invention relates to semiconductor wafer manufacturing equipment, more specifically to a method for cutting and manufacturing a silicon carbide boat in the semiconductor wafer production process. Background technique

[0002] In the prior art, a high-purity silicon carbide boat is a carrier for large-scale integrated circuits during ultra-high temperature processing. The chip processing process of large-scale integrated circuits requires a non-polluting environment, so the carrier used should be of extremely high purity, and the content of Na, Fe, Mn, Cu, Cr, K, etc. must not exceed the standard. After cleaning, the silicon carbide boat is clean and free of dirt, and it will not deform for a long time under high temperature environment. The production of semiconductor wafers must be carried out in a quartz heat treatment furnace. As a processed semiconductor wafer, it must be placed on a high-purity carrier (or "boat") and sent into the quartz hea...

Images