Cutting making process of silicon carbide boat for chip manufacture

A technology of silicon carbide boat and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, metal processing, electrical components, etc., can solve the problems of high processing cost, high cost, high damage rate, etc., and achieve high precision, high production efficiency, The effect of low breakage rate

Inactive Publication Date: 2002-10-23
张彩根
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This material is hard and brittle, difficult to process and expensive
In the prior art, the manufacturing methods of this silicon carbide boat include casting method, laser cutting method and grinding and cutting method (with diamond grinding and cutting blade). These processing methods all have the problems of large equipment investment and high processing cost. The grinding and cutting method There is also the disadvantage of high damage rate, which also leads to high cost

Method used

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  • Cutting making process of silicon carbide boat for chip manufacture
  • Cutting making process of silicon carbide boat for chip manufacture
  • Cutting making process of silicon carbide boat for chip manufacture

Examples

Experimental program
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Embodiment Construction

[0010] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0011] first embodiment, figure 1 Shown is the schematic diagram of the wire cutting processing equipment and technology that the present invention is used for processing and manufacturing the silicon carbide boat that semiconductor wafer is used, and workpiece 1 is clamped on the workbench by fixture, and the cutting that is made up of a roller and two guide wheels Wire drive train, that roller on the top is the winding driving roller 2, and guide wheels 3, 3' can regulate the tension of cutting line 4. The core wire of the cutting wire 4 is a tungsten-molybdenum wire, and the outer part includes corundum powder coating. The particle size of described corundum powder is 260 grains / cm 2 , the hardness of the diamond powder is 10 on the Mohs scale. The cutting line 4 is wound on the drive roller 2 (see figure 2 ), the rotational speed of t...

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PUM

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Abstract

The linear cutting process for manufacturing carborundum boat for making wafer includes the following steps: (1). cutting carborundum tube to obtain blank material; (2) cutting blank to form and combing to produce comb gap; (3) cleaning primary product for several times, its cleaning liquor includes detergent, chlorylene, sulfuric acid and hydrogen peroxide, fluohydric acid and pure water, etc.; (4). annealing, heat treatment; (5) secondary cleaning; (6) polishing primary product by adopting oxyhydrogen H2O2; (7) more annealing heat treatment for eliminating stress produced by polishing step;(8). further cleaning; and (9) projecting and detecting primary product to obtain the invented finished product.

Description

technical field [0001] The invention relates to semiconductor wafer manufacturing equipment, more specifically to a method for cutting and manufacturing a silicon carbide boat in the semiconductor wafer production process. Background technique [0002] In the prior art, a high-purity silicon carbide boat is a carrier for large-scale integrated circuits during ultra-high temperature processing. The chip processing process of large-scale integrated circuits requires a non-polluting environment, so the carrier used should be of extremely high purity, and the content of Na, Fe, Mn, Cu, Cr, K, etc. must not exceed the standard. After cleaning, the silicon carbide boat is clean and free of dirt, and it will not deform for a long time under high temperature environment. The production of semiconductor wafers must be carried out in a quartz heat treatment furnace. As a processed semiconductor wafer, it must be placed on a high-purity carrier (or "boat") and sent into the quartz hea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F3/12C01B31/36H01L21/68
Inventor 张彩根
Owner 张彩根
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