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Installing device and method for electronic component

An electronic component installation, electronic component technology, applied in the direction of assembling printed circuits, electrical components, electrical components, etc. with electrical components, can solve problems such as undesirable interference and/or waiting time, unbalanced installation operations, etc.

Inactive Publication Date: 2002-11-27
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This difference leads to an unbalanced installation operation and a sequence between the beams which can lead to undesired interference and / or waiting times between the beams

Method used

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  • Installing device and method for electronic component
  • Installing device and method for electronic component
  • Installing device and method for electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0019] See figure 1 , which shows the electronic component mounting apparatus of the first embodiment of the present invention. A transfer channel 2 is formed along the X-axis direction at the center of the base 1 . The conveying lane 2 is constituted by conveying rails 2a and 2b for carrying the substrate 3 between the conveying rails 2a and 2b and setting the substrate in position. The transport rail 2a can move along the Y-axis direction, which is perpendicular to the conveying direction, that is, the X-axis direction. Moving the transport rail 2a in the Y-axis direction allows the transport width, that is, the distance between the transport rails 2a and 2b, to vary according to the size of the substrate 3.

[0020] Component supply members 4 a and 4 b for supplying electronic components are provided on both sides of the conveyance path 2 . A plurality of tape feeders 5 are provided in a row to each of the component supply members 4a and 4b. Each tape feeder 5 accommoda...

no. 2 example

[0049] See Figure 5 , 6 and 7, the second embodiment of the present invention will now be described. This second embodiment is an arrangement of the first embodiment that enables the transfer rails 2a and 2b to move integrally with other elements including the component supply members 4a and 4b. In the second embodiment, substantially the same components as in the first embodiment are given the same reference numerals.

[0050] See Figure 5 and 6 , a pair of guide rails 31 are installed on the base 1 a of the base 1 along the Y-axis on each side of the conveyance path 2 . The slider 32 is loosely fitted on the guide rail 31 so that the slider 32 can slide on the guide rail 31 . Sliders 32 are also attached to the bottom surfaces of the movable bases 30 a and 30 b horizontally on each side of the conveying channel 2 .

[0051] Component supply members 4a and 4b including tape feeders 5 are placed on movable bases 30a and 30b, respectively. The transfer rails 2a and 2b ...

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PUM

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Abstract

An apparatus and method for mounting electronic components, wherein the conveying width between a pair of conveying rails can be varied according to the size of a substrate. A mounting head picks electronic components at the component supply member and holds their ready positions for mounting the electronic components on the substrate. The alternate position of the mounting head is determined based on the amount of change in the transport width.

Description

[0001] Related applications for reference [0002] This application is based on and claims priority from Japanese Patent Application No. 2001-98681 filed on March 30, 2001, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to apparatus and methods for mounting electronic components on substrates. Background technique [0004] US Patent No. 5,778,525 discloses a conventional component mounting apparatus having two mounting heads for picking electronic components from a component supply table and mounting them on a substrate (circuit board). [0005] Such mounting devices (so-called twin-beam type) usually handle several substrates with different dimensions. Every time the substrate size is changed, some adjustment will be done, ie changing the transport width between the transport tracks. In this case, usually only one of the conveying rails is moved in the conveying width direction so that the conveying width...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/00H05K13/04
CPCH05K13/0061H05K13/0411Y10T29/49144Y10T29/49131Y10T29/53174Y10T29/4913Y10T29/49133Y10T29/53178
Inventor 永尾和英堤卓也野田孝浩角英树
Owner PANASONIC CORP