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Method for cutting slice from workpiece

A technology for cutting workpieces and saws, which is applied in the field of cutting thin slices, and can solve problems such as insufficient compensation for workpiece temperature fluctuations

Inactive Publication Date: 2002-12-18
WACKER SILTRONIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The disadvantage of all these methods is that the compensation for temperature fluctuations of the workpiece is still insufficient

Method used

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  • Method for cutting slice from workpiece

Examples

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Embodiment 1

[0021] All the parameters selected by this method are the same as in Comparative Example 1. Furthermore, the temperature control of the present invention is used instead of a constant dilute mortar temperature, so that cooling liquids of different temperatures flow to the workpiece via the nozzles 16 in such a way that variations in workpiece temperature are kept as low as possible. In this case, if figure 2 The internal standard is shown by the curve of B1, and the fluctuation of the workpiece temperature is only about 3°C. As a result, the maximum warpage of sawn wafers can be reduced from the usual 15 microns to 10 microns.

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Abstract

The invention discloses a method for cutting a bar-shaped or block-shaped workpiece with a saw, wherein the temperature of the workpiece is measured during the cutting process, and the measurement signal is transmitted to a control device, and the control signal generated by the control device is used To control the temperature of the workpiece; or during the cutting process, the temperature of the workpiece is controlled by the control signal according to the control curve determined in advance.

Description

technical field [0001] The invention relates to a method for cutting out thin slices from a workpiece, in particular to a method for cutting out semiconductor wafers (Harbleiterscheibe) from rod-shaped or bulk semiconductor material. Background technique [0002] Usually the semiconductor wafers are cut out simultaneously by means of a wire saw a plurality of semiconductor wafers at a time from a monocrystalline or polycrystalline workpiece of rod-shaped or block-shaped semiconductor material. [0003] The basic components of such wire saws consist of a frame, a feed device (Vorschubeinrichtung) and a sawing tool, which is a network of parallel wire segments, as described in German patent application 19959414.7-14, The wire mesh consists of a series of parallel individual wires collapsed through a frame. Typically, the wire mesh is formed from a number of parallel wire lengths that are collapsed between at least two wire guide rollers mounted on rotating shafts, at least on...

Claims

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Application Information

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IPC IPC(8): B24B27/06B28D5/00B28D5/04B28D7/02H01L21/301H01L21/304
CPCB28D5/0064B28D5/0076H01L21/30
Inventor 霍尔格·伦特洛塔尔·胡贝尔彼得·维斯纳
Owner WACKER SILTRONIC
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