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Method for cutting slice from workpiece

A workpiece and saw cutting technology, applied in the field of cutting thin slices, can solve problems such as insufficient compensation for temperature fluctuations of workpieces

Inactive Publication Date: 2006-11-15
WACKER SILTRONIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The disadvantage of all these methods is that the compensation for temperature fluctuations of the workpiece is still insufficient

Method used

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  • Method for cutting slice from workpiece

Examples

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Effect test

Embodiment 1

[0022] Example 1: Controlled Processing

[0023] All the parameters selected by this method are the same as in Comparative Example 1. Furthermore, the temperature control of the present invention is used instead of a constant dilute mortar temperature, so that cooling liquids of different temperatures flow to the workpiece via the nozzles 16 in such a way that variations in workpiece temperature are kept as low as possible. In this case, if figure 2 The internal standard is shown by the curve of B1, and the fluctuation of the workpiece temperature is only about 3°C. As a result, the maximum warpage of sawn wafers can be reduced from the usual 15 microns to 10 microns.

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Abstract

The invention discloses a method for cutting a bar-shaped or block-shaped workpiece with a saw, wherein the temperature of the workpiece is measured during the cutting process, and the measurement signal is transmitted to a control device, and the control signal generated by the control device is used To control the temperature of the workpiece; or during the cutting process, the temperature of the workpiece is controlled by the control signal according to the control curve determined in advance.

Description

technical field [0001] The invention relates to a method for cutting out thin slices from a workpiece, in particular to a method for cutting out semiconductor wafers (Harbleiterscheibe) from rod-shaped or bulk semiconductor material. Background technique [0002] Usually the semiconductor wafers are cut out simultaneously by means of a wire saw a plurality of semiconductor wafers at a time from a monocrystalline or polycrystalline workpiece of rod-shaped or block-shaped semiconductor material. [0003] The basic components of such wire saws consist of a frame, a feed device (Vorschubeinrichtung) and a sawing tool, which is a network of parallel wire segments, as described in German patent application 19959414.7-14, The wire mesh consists of a series of parallel individual wires collapsed through a frame. Typically, the wire mesh is formed from a number of parallel wire lengths that are collapsed between at least two wire guide rollers mounted on rotating shafts, at least on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/10H01L21/304B24B27/06B28D5/00B28D5/04B28D7/02H01L21/301
CPCB28D5/0064B28D5/0076H01L21/30
Inventor 霍尔格·伦特洛塔尔·胡贝尔彼得·维斯纳
Owner WACKER SILTRONIC
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