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Magnetic head with IC bare chip between height limiting plate and cantilever enclosed with resin and its mfg. method

A manufacturing method, a technology of a magnetic head, applied to the structure of the arm part, aligning the magnetic track on the magnetic disk, supporting the head, etc., can solve the problem of increasing the emission of dust, etc.

Inactive Publication Date: 2003-01-29
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conversely, when a part of the IC chip is exposed due to the lack of resin material, the possibility of dust emission will increase

Method used

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  • Magnetic head with IC bare chip between height limiting plate and cantilever enclosed with resin and its mfg. method
  • Magnetic head with IC bare chip between height limiting plate and cantilever enclosed with resin and its mfg. method
  • Magnetic head with IC bare chip between height limiting plate and cantilever enclosed with resin and its mfg. method

Examples

Experimental program
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Embodiment Construction

[0016] figure 2, image 3 An example of the overall configuration of a suspension-type magnetic head provided with a chip is shown. A magnetic head (slider) 11 is provided at the front end of the suspension 10 made of stainless steel. As is well known, the magnetic head 11 is used to record and read magnetic information on a recording disk. The base end of the suspension arm 10 is provided with a rotation fulcrum 10a positioned outside the recording disk. When the suspension arm 10 swings around the rotation fulcrum 10a, the magnetic head 11 at the free end moves in the radial direction of the recording disk. An FPC 12 having a predetermined pattern wiring 12 a is arranged along the suspension 10 , and the magnetic head 11 is connected to an external control circuit 13 through the FPC 12 .

[0017] An IC chip (semiconductor device) 14 is fixed on the FPC 12 and connected in series in a signal connection circuit between the magnetic head 11 and the external control circuit 13...

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PUM

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Abstract

A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.

Description

technical field [0001] The present invention relates to a suspension-type magnetic head provided with a chip and a manufacturing method thereof. Background technique [0002] The cantilever-type magnetic head with a chip is used as a magnetic head that immediately amplifies the weak read signal output from the magnetic head through the IC chip installed on the cantilever to reduce the influence of noise caused by parasitic capacitance and parasitic inductance. public knowledge. That is, on the suspension that supports the magnetic head, along the FPC that connects the magnetic head and the control circuit, on the FPC, and on the signal circuit between the magnetic head and the control circuit, IC chips are arranged in series. [0003] In order to mount the IC chip on the cantilever, it is necessary to prevent the IC chip from emitting dust while protecting the IC chip from the surrounding environment (temperature, humidity) and vibration. That is, since the IC chip is made...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B5/60G11B5/48G11B21/21
CPCG11B5/4833H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/00
Inventor 渡部充
Owner TDK CORPARATION