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Electronic apparatus

A technology for electronic devices and containers, which is applied to circuits, electrical components, and electric solid-state devices, etc., can solve the problems of low thermal response of heat storage materials and time-consuming heat conduction of heat storage components.

Inactive Publication Date: 2004-03-24
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when contacting the surface of the semiconductor element as in the above-mentioned known technology, there is a limitation in the contact area, and there is a problem that it takes time to conduct heat to the entire heat storage member and the thermal responsiveness to the heat storage material is low.

Method used

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Embodiment Construction

[0017] In recent years, with the popularization of mobile phones, adding value to mobile phones has become the direction. For example, there are those equipped with video cameras, those that can send and receive animation, and those that can enjoy music. I believe that the demand for high added value will be even higher in the future.

[0018] For example, when a mobile phone functions as an information terminal loaded with various software, it is natural that semiconductor elements inside the mobile phone generate high heat, and cooling of the semiconductor elements corresponding to high temperatures is required.

[0019] At present, the heat dissipation of a general mobile phone is to conduct the heat from the semiconductor element to the frame forming the outer shell of the mobile phone and dissipate it. Also can not make the hand heat and bring uncomfortable feeling to the user.

[0020] However, if the temperature of the semiconductor element is 50° C. to 60° C. which is...

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PUM

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Abstract

An electronic apparatus, comprising: a plate-like container, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with said container, thermally; and a housing covering said semiconductor element and said container, wherein a surface of said container, in contact with said semiconductor element, is provided with recess portions in plural numbers thereof, each being recessed in a direction of said heat-accumulating material of latent heat type, so as to enclose said heat-accumulating material of latent heat type into said recess portions, and said plate-like container and said housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.

Description

technical field [0001] The invention relates to an electronic device loaded with heating elements. Background technique [0002] In Japanese Patent Application Laid-Open No. 6-214067 (page 2, figure 1 ) in the example, the heat storage member is installed in the heating element. [0003] Generally, paraffins are used as heat storage materials. [0004] The heat storage material absorbs heat, and the solid paraffin has the highest heat absorption effect when it becomes liquid. However, since the thermal conductivity of paraffin is not good, the larger the contact surface between the heating element and the paraffin, the higher the effect. [0005] However, when contacting the surface of the semiconductor element as in the above-mentioned known technology, the contact area is limited, the heat conduction to the entire heat storage member takes time, and the thermal responsiveness to the heat storage material is low. Contents of the invention [0006] An object of the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/36H01L23/427
CPCH01L23/4275H01L2924/0002H01L2924/00
Inventor 中西正人大桥繁男平泽茂树
Owner HITACHI LTD