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Resin composition, process for producing resin composition, and method of forming resin film

A technology of resin composition and resin film, which is applied in the direction of optomechanical equipment, printed circuit manufacturing, multilayer circuit manufacturing, etc., and can solve difficult problems such as circuit wiring of resin film

Inactive Publication Date: 2004-06-09
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In any case, it is difficult to perform high-precision circuit wiring on a resin film composed of polyimide resin by exposure and development

Method used

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  • Resin composition, process for producing resin composition, and method of forming resin film
  • Resin composition, process for producing resin composition, and method of forming resin film
  • Resin composition, process for producing resin composition, and method of forming resin film

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Experimental program
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Embodiment

[0125] After dissolving 11.4 g (0.1 mol) of alicyclic diamine 1,4-diaminocyclohexane in 867 g of a solvent (N-methylpyrrolidone) in a reaction vessel, slowly add aromatic acid dianhydride 3 while stirring, 29.4 g of 3',4,4'-biphenyltetracarboxylic dianhydride powder formed a white complex salt (salt), and obtained a resin solution.

[0126] Next, the reaction container was immersed in an oil bath, and the temperature of the resin solution was raised to 120° C., and then the resin solution was stirred for 5 minutes while maintaining the temperature at this temperature. When part of the white complex salt just dissolves, take out the reaction vessel from the oil bath, and continue to stir the reaction solution at room temperature for several hours to obtain a transparent and highly viscous resin solution.

[0127] In this resin solution, have formed the polyimide precursor of the unit that has the polymerization structure shown in above-mentioned formula (1), the chemical struct...

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Abstract

Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A<2>includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

Description

technical field [0001] The present invention relates to a technique of a wiring board having a resin film, and particularly relates to a technique of performing circuit wiring on a resin film on a metal wiring. Background technique [0002] For a long time, imidization of a resin composition containing a polyimide precursor by heating has been widely used as an insulating film (resin film) for semiconductors and wiring boards. [0003] In recent years, attempts have been made to make polyimide resin photosensitive and to perform circuit wiring on a resin film composed of polyimide resin by an exposure method, but generally, widely used aromatic polyimide Amines are obviously colored by forming complexes through intramolecular conjugation and charge movement. In a wide wavelength range from ultraviolet light to visible light, the light transmittance is significantly low, and it is difficult to perform circuit wiring through exposure. [0004] The light transmittance is highe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/037C08G73/10C08K5/00C08L79/08C09D5/00C09D179/08G03F7/022G03F7/023H01L21/027H05K3/46
CPCH05K3/4644G03F7/0233C08K5/0025G03F7/022C08L79/04
Inventor 野村麻美子长谷川匡俊石井淳一赤松正
Owner DEXERIALS CORP