Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Luminous diode

A technology of light-emitting diodes and surface electrodes, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of reduced transparency, unreliability, discoloration of transparent seals, etc.

Inactive Publication Date: 2005-02-16
CITIZEN ELECTRONICS CO LTD
View PDF2 Cites 42 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the LED chip is heated, and there is a problem that the luminance of light emission decreases.
In addition, the working life of the LED chip becomes shorter when working at a higher temperature
In addition, there is a problem that the transparent sealing body that seals the LED chip is discolored due to heat, and the transparency is lowered
In addition, there is the problem that LED chips tend to have shorter working life and are less reliable when used in high output and high brightness applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Luminous diode
  • Luminous diode
  • Luminous diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] A preferred embodiment of a light emitting diode according to the present invention will be explained with reference to the accompanying drawings.

[0020] figure 1 The light emitting diode 1 of the first embodiment of the present invention will be described by way of example.

[0021] The light emitting diode 1 includes an LED chip 4, an insulating circuit substrate 3 in which the LED chip 4 is placed, and a printed wiring board 2. The insulating circuit substrate 3 is made of glass epoxy, silicone or the like.

[0022] Provided on the circuit substrate 3 are a pair of integrally formed upper and lower surface electrodes 5a, 6a and 5b, 6b.

[0023] The circuit substrate 3 has a heat radiation mechanism 7 . Radiation mechanism 7 comprises a heat radiation part 9, and it is in figure 1 is arranged in the storage portion 8 formed in the substantially central portion of the circuit substrate 3 in the embodiment shown in . The storage portion 8 includes, for example, a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light emitting diode, comprising a circuit substrate, an LED chip, a heat radiating mechanism provided on said circuit substrate and supporting said LED chip to receive heat from the LED chip and radiate the heat, and a sealing body provided on said circuit substrate to cover said LED chip

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of priority from Japanese Patent Application No. 2003-207530, filed on August 13, 2003, the entire description of which is incorporated herein by reference. technical field [0003] The present invention relates to light emitting diodes for commercial devices such as personal computers, printers, PDAs (Personal Digital Assistants), facsimiles, pagers, and mobile phones, and more particularly, to light emitting diodes having excellent heat release effects. Background technique [0004] Conventionally, in surface mount light-emitting diodes pursuing slimming and miniaturization of electronic devices, there has been known a structure in which LED chips are mounted on electrode patterns formed on the upper surface of a glass epoxy resin substrate, and a transparent resin is provided. On the substrate to seal the LED chip (Japanese Patent Publication 2002-280614, p2, Fig.4). [0005] Fig. 3 i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/56H01L33/62H01L33/64
CPCH01L33/642H01L33/486H01L33/647H01L2224/48091H01L2924/00014
Inventor 今井貞人
Owner CITIZEN ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com