Integrated circuit chip
A technology of integrated circuits and chips, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems affecting the electrical quality of integrated circuit chips 40, accumulation, and the inability to transfer charges to P-type silicon substrates 44
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[0072] Please refer to Figures 4~6 at the same time. Figure 4 Showing a top view of an integrated circuit chip according to a preferred embodiment of the present invention, Figure 5 shows along Figure 4 Partially enlarged cross-sectional view of the integrated circuit chip viewed by the cross-hatching line 5-5', Image 6 means along Figure 4 Partially enlarged cross-sectional view of the integrated circuit chip viewed by the section line 6-6'. In Figures 4-6, the integrated circuit chip 70 includes a silicon substrate 57, a fixed seal ring (seal ring) 71, a ground ring (ground ring) 72, at least one circuit and an output / input pad (input / output pad) , I / O pad) and at least one guard ring (guard ring), such as digital circuit 73, radio frequency circuit 74 and guard rings 55 and 56. Wherein, the digital circuit 73 and the radio frequency circuit 74 respectively have an output / input pad 73a and 74a. Fixed seal ring 71 , ground ring 72 , digital circuit 73 , radio frequenc...
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