Grinding device

A technology for grinding and processing objects, which can be used in the direction of grinding machine parts, grinding/polishing equipment, grinding machines, etc., and can solve problems such as thickness deviation of semiconductor wafers

Inactive Publication Date: 2006-01-11
DISCO CORP
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Problems solved by technology

[0003] However, since the protective tape for protecting the circuit is attached to the surface of the semiconductor wafer, the thickness of the semiconductor wafer after grinding also varies due to the thickness variation of the protective tape in the above-mentioned grinding method.
That is, in the above-mentioned grinding method, since the grinding is performed while recognizing the combined thickness of the semiconductor wafer and the protective tape, the thickness of the semiconductor wafer after grinding also varies due to the variation in the thickness of the protective tape.

Method used

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Embodiment Construction

[0013] Hereinafter, preferred embodiments of the grinding device according to the present invention will be described with reference to the accompanying drawings.

[0014] Fig. 1 is a perspective view showing a grinding apparatus constructed according to the present invention.

[0015] The grinding device in the illustrated embodiment has a device housing 2 in the shape of a roughly cuboid. At the upper right end in FIG. 1 of the device housing 2, a stationary support plate 21 is erected. On the inner surface of the stationary support plate 21, two pairs of guide rails 22, 22 and 23, 23 extending in the vertical direction are provided. A rough grinding device 3 as a rough grinding mechanism is installed on one guide rail 22, 22 so as to be movable up and down; The fine grinding device 4 of the fine grinding mechanism.

[0016] Rough grinding device 3 has device housing 31, and the rough grinding wheel 33 that is installed on the wheel support 32 of the lower end of this dev...

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Abstract

PROBLEM TO BE SOLVED: To provide a grinding apparatus capable of grinding a workpiece to the predetermined finishing thickness, without being influenced by a variation in the thickness of a protective tape, even if a reverse surface is ground by sticking the protective tape to a surface of the workpiece. ŽSOLUTION: This grinding apparatus has a chuck table having a holding surface for holding the workpiece, a grinding means for grinding the workpiece held by the holding surface of the chuck table, a grinding feeding means for feeding the grinding means for grinding in the perpendicular direction to the holding surface of the chuck table, and a height gauge for detecting a height position of an upper surface of the workpiece held by the chuck table; and has a thickness measuring apparatus for detecting the thickness of the workpiece, and a control means for controlling the grinding means and the grinding feeding means on the basis of detecting data from the thickness measuring apparatus and the height gauge. The control means calculates a target grinding quantity from the thickness of pre-processing workpiece detected by a thickness detector and finishing thickness data on the workpiece, and grinds up to reaching a height position corresponding to the target grinding quantity from the height position of the pre-processing workpiece on the basis of the detecting data from the height gauge. Ž

Description

technical field [0001] The present invention relates to a grinding device for grinding a workpiece such as a semiconductor wafer to a predetermined thickness. Background technique [0002] In the manufacturing process of semiconductor devices known to those skilled in the art, the semiconductor wafer forming a plurality of circuits such as ICs and LSIs is ground by a grinding device to form predetermined wafers before being divided into individual chips. thickness. A grinding device for grinding the back surface of a semiconductor wafer is provided with a chuck holding a semiconductor wafer, a grinding mechanism for grinding the semiconductor wafer held on the chuck, and the grinding mechanism is positioned perpendicular to the chuck. The grinding feed mechanism for grinding feed in the direction of the holding surface of the table, and the altimeter for detecting the height position of the upper surface (inner side) of the semiconductor wafer held by the table, which uses ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B49/00B24B7/22B24B49/02H01L21/304
Inventor 高泽彻
Owner DISCO CORP
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