Grinding device

A technology for grinding and processing objects, which can be used in the direction of grinding machine parts, grinding/polishing equipment, grinding machines, etc., and can solve problems such as thickness deviation of semiconductor wafers
CN1718370AInactive Publication Date: 2006-01-11DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2006-01-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

PROBLEM TO BE SOLVED: To provide a grinding apparatus capable of grinding a workpiece to the predetermined finishing thickness, without being influenced by a variation in the thickness of a protective tape, even if a reverse surface is ground by sticking the protective tape to a surface of the workpiece. ŽSOLUTION: This grinding apparatus has a chuck table having a holding surface for holding the workpiece, a grinding means for grinding the workpiece held by the holding surface of the chuck table, a grinding feeding means for feeding the grinding means for grinding in the perpendicular direction to the holding surface of the chuck table, and a height gauge for detecting a height position of an upper surface of the workpiece held by the chuck table; and has a thickness measuring apparatus for detecting the thickness of the workpiece, and a control means for controlling the grinding means and the grinding feeding means on the basis of detecting data from the thickness measuring apparatus and the height gauge. The control means calculates a target grinding quantity from the thickness of pre-processing workpiece detected by a thickness detector and finishing thickness data on the workpiece, and grinds up to reaching a height position corresponding to the target grinding quantity from the height position of the pre-processing workpiece on the basis of the detecting data from the height gauge. Ž
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Description

technical field

[0001] The present invention relates to a grinding device for grinding a workpiece such as a semiconductor wafer to a predetermined thickness. Background technique

[0002] In the manufacturing process of semiconductor devices known to those skilled in the art, the semiconductor wafer forming a plurality of circuits such as ICs and LSIs is ground by a grinding device to form predetermined wafers before being divided into individual chips. thickness. A grinding device for grinding the back surface of a semiconductor wafer is provided with a chuck holding a semiconductor wafer, a grinding mechanism for grinding the semiconductor wafer held on the chuck, and the grinding mechanism is positioned perpendicular to the chuck. The grinding feed mechanism for grinding feed in the direction of the holding surface of the table, and the altimeter for detecting the height position of the upper surface (inner side) of the semiconductor wafer held by the table, which uses ...

Claims

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