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Gap nozzle,substrate processing apparatus and method

A technology of slit nozzles and nozzles, which is applied in the direction of spraying devices, spraying devices, devices for coating liquid on the surface, etc., which can solve the problems of unstable film thickness, etc., and achieve the suppression of changes in coating width, shrinking expansion width, and suppression Effects of Film Thickness Variations

Active Publication Date: 2006-09-20
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, if the coating width W fluctuates in this way, the thickness of the film formed along with it will also become unstable.

Method used

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  • Gap nozzle,substrate processing apparatus and method
  • Gap nozzle,substrate processing apparatus and method
  • Gap nozzle,substrate processing apparatus and method

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no. 1 approach

[0072] First, a first embodiment of the side plate 72 will be described. FIG. 3 is a cross-sectional view of the vicinity of the side plate 721 of the first embodiment cut along a plane including the liquid-feeding passage 73 . In addition, in FIG. 3 and FIG. 5 to FIG. 16, only the side plate vicinity of one side is shown, but the side plate vicinity of the other side also has the same structure.

[0073] The side plate 721 is processed so that the thickness d of the Y direction in the lower end part 721a may be 0.7 mm or less. Therefore, even if the resist liquid 90 discharged from the discharge port 74 expands toward the side plate 721 (the state of the dotted line in FIG. 3 ), the expansion width is suppressed within the range of the thickness d in many cases. This is because the expansion of the resist liquid 90 is mainly caused by the influence of the meniscus that occurs between the lower end portion 721 a of the side plate 721 . Therefore, fluctuations in the coating ...

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Abstract

The invention relates to a method for coating process liquid with stable coating width by narrow nozzle. Wherein, the thickness (d) of lower end (721a) of the side plate (721) of narrow nozzle is under 0.7mm; therefore, even the motion speed of narrow nozzle (42) is slow, or the viscidity of corrosion resisting liquid is lower, the invention can reduce the outward expansion width of coated corrosion resisting liquid 90, to restrain the change of coated width.

Description

technical field [0001] The present invention relates to a method for applying a treatment liquid to the surface of a glass substrate for liquid crystal, a semiconductor substrate, a flexible substrate for thin-film liquid crystal, a substrate for a photomask, a substrate for a color filter, etc. (hereinafter referred to simply as "substrate") A slit nozzle, a substrate processing apparatus having the slit nozzle, and a substrate processing method using the slit nozzle. Background technique [0002] Conventionally, the manufacturing process of a substrate includes a coating step of coating a processing liquid such as a photoresist on the surface of the substrate. In the coating step, a coating device (so-called slit coater) that discharges the treatment liquid onto the substrate surface from a slit nozzle having a slit-shaped discharge portion is used. [0003] FIG. 22 shows a state in which a coating process is performed by a conventional coating device 100 . The coating d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B1/04B05C5/02
CPCA47J36/06A47J37/10
Inventor 池田文彦楫野一树细川章宏吉田顺一
Owner DAINIPPON SCREEN MTG CO LTD