Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate for magnetic recording medium, magnetic recording medium and magnetic recording/reproducing device

A magnetic recording medium and substrate technology, applied in the direction of the base layer of the recording layer, magnetic recording, magnetic recording layer, etc., can solve the problems of unavailability

Inactive Publication Date: 2007-06-27
RESONAC HOLDINGS CORPORATION
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, silicon substrates have not been brought to a practical state so far due to the unavailability of techniques for imparting suitable roughness to their surfaces

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate for magnetic recording medium, magnetic recording medium and magnetic recording/reproducing device
  • Substrate for magnetic recording medium, magnetic recording medium and magnetic recording/reproducing device
  • Substrate for magnetic recording medium, magnetic recording medium and magnetic recording/reproducing device

Examples

Experimental program
Comparison scheme
Effect test

example

[0090] A silicon substrate measuring an outer diameter of 25.4 mm, an inner diameter of 7.0 mm and a plate thickness of 0.38 mm was used. The Si substrate is a single crystal having a (111) crystal orientation on its surface. The Si substrate was polished to a mirror finish Ra of 2.3 A. The samples were subjected to etching treatment, rinsed with a cleaning solution having ammonia water and hydrochloric acid water as main components, and then dried. Tables 1 and 2 below show alkali components and surfactant components contained in etchant, their concentrations, etching temperature, and etching time. Table 2 shows the data obtained from samples that underwent etching, drying and texturing. Conditions for texturing are as follows. The abrasive grains contained in the slurry were diamond abrasive grains having a D90 of 0.15 μm. The slurry was added dropwise at a rate of 50 ml / min for a period of two seconds before the treatment started. As the polishing tape, a woven fabric ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A method for the production of a substrate for a magnetic recording medium includes subjecting a silicon substrate to a chemical etching treatment using an etchant containing an aqueous alkali solution and a surfactant. The substrate for a magnetic recording medium is provided on the surface thereof with irregularities possessing a value of contact ratio (BH 1.0 nm) of 5% or more and 20% or less in a region of a height of 1.0 nm or more, based on the height at which the contact ratio reaches 50% in the surface coarseness load curve. A magnetic recording medium can be provided using the substrate for a magnetic recording medium on which a magnetic film, a projective film and a lubricant layer are disposed. The magnetic recording medium is famished on the surface thereof with irregularities having a value of contact ratio (BH 1.0 nm) of 5% or more and 20% or less in a region of a height of 1.0 nm or more, based on a height at which the contact ratio reaches 50% in a surface coarseness load curve. A magnetic recording and reproducing device can be provided using the magnetic recording medium and a magnetic head adapted to record and reproduce data in the magnetic recording medium.

Description

[0001] Cross References to Related Applications [0002] This application is based upon an application filed under 35 U.S.C. §111(a) pursuant to U.S.C. §119(e)(1), requiring Provisional Application No. 60 / 557,997 and priority of Japanese Patent Application No. 2004-166472 filed June 4, 2004. technical field [0003] The present invention relates to a substrate for a magnetic recording medium used in a hard disk device, a method of manufacturing a substrate for a magnetic recording device, a magnetic recording device, and a magnetic recording and reproducing device. In particular, the present invention relates to a substrate for a magnetic recording medium utilizing a small-diameter silicon substrate exhibiting excellent floating characteristics and having a surface shape suitable for ramp loading operation, and a method for manufacturing the substrate for the magnetic recording medium method. Background technique [0004] Generally, a magnetic recording and reproducing ap...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G11B5/84G11B5/73
CPCG11B5/7315G11B5/7325Y10T428/115G11B5/8404G11B5/73911
Inventor 大泽弘
Owner RESONAC HOLDINGS CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com