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Thermal management apparatus, systems, and methods

Inactive Publication Date: 2006-07-06
HALLIBURTON ENERGY SERVICES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The variety of such components available to designers may be somewhat limited, however, and those that are available can be relatively expensive and difficult to obtain.
In addition, managing thermal conditions associated with such components used in the downhole environment can be difficult, since operations can continue for days at a time.

Method used

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  • Thermal management apparatus, systems, and methods
  • Thermal management apparatus, systems, and methods
  • Thermal management apparatus, systems, and methods

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Embodiment Construction

[0009] In some embodiments, an element that serves as both a chassis and a heat exchanger may be thermally coupled to a plurality of electronic devices using a corresponding plurality of receiving sections (e.g., machined recesses tailored to receive the individual devices). The chassis heat exchange element may include a conduit thermally coupled to the chassis heat exchange element. A flow rate regulator may be used adjust the flow rate of a coolant (e.g., water, oil, etc.) circulated in the conduit. In some embodiments, thermally conductive, flow disruptive elements may be included in the conduit. In some embodiments, the chassis heat exchange element may be used in conjunction with downhole drilling and logging operations.

[0010] For the purposes of this document, a “chassis heat exchange element” may mean any substantially rigid structure that serves both as a chassis and as a heat exchange device in direct thermal communication with at least one electronic device from which he...

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PUM

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Abstract

An apparatus and a system, as well as a method and article, may operate to circulate a coolant through a thermal conduit thermally coupled to a chassis heat exchange element including a plurality of receiving sections thermally coupled to a corresponding plurality of electronic devices. The temperature of one or more of the plurality of electronic devices may be sensed, and the flow rate of the coolant adjusted in accordance with the sensed temperature. The thermal conduit may include thermally conductive, flow disrupting elements. The chassis heat exchange element may operate in a downhole environment, including logging and drilling operations.

Description

RELATED APPLICATIONS [0001] This disclosure is related to pending U.S. patent application Ser. No. 10 / 602,236, titled “Method and Apparatus for Managing the Temperature of Thermal Components”, by Bruce H. Storm, Jr. and Haoshi Song, filed on Jun. 24, 2003, and is assigned to the assignee of the embodiments disclosed herein, Halliburton Energy Services, Inc.TECHNICAL FIELD [0002] Various embodiments described herein relate to thermal management generally, including apparatus, systems, and methods used to manage electronic device thermal conditions. BACKGROUND INFORMATION [0003] Electronic devices may be designed to operate at a variety of temperatures, including up to about 200 C or greater, which is approximately the same as the ambient temperature experienced by various downhole drilling components. The variety of such components available to designers may be somewhat limited, however, and those that are available can be relatively expensive and difficult to obtain. In addition, ma...

Claims

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Application Information

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IPC IPC(8): E21B7/00
CPCE21B47/011H05K7/20281E21B47/017E21B47/0175
Inventor STORM, BRUCE H. JR.FREEMAN, JAMES J.JAKABOSKI, JUAN-CARLOSJOSHI, YOGENDRA
Owner HALLIBURTON ENERGY SERVICES INC