Method for controlling polishing fluid distribution
a technology of fluid distribution and fluid distribution, which is applied in the direction of grinding machine components, manufacturing tools, lapping machines, etc., can solve the problems of not being completely satisfactory, tendency of some materials to be removed faster than the surrounding materials,
Inactive Publication Date: 2006-11-02
APPLIED MATERIALS INC
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AI Technical Summary
Benefits of technology
The invention provides an apparatus and method for delivering a polishing fluid to a chemical mechanical polishing surface. The apparatus includes an arm with multiple holes for holding polishing fluid delivery tubes, which can be controlled to control the distribution of polishing fluid and the polishing rates across a substrate being polished. The method involves delivering polishing fluid to different parts of the polishing surface through different tubes, allowing for precise control of the polishing process. Overall, the invention improves the efficiency and accuracy of chemical mechanical polishing.
Problems solved by technology
One of the challenges in developing robust polishing systems and processes is controlling the uniformity of material removed across the polished surface of the substrate.
Another problem affecting polishing uniformity across the substrate's surface is the tendency of some materials to be removed faster than the surrounding materials.
Although many solutions have been utilized in order to mitigate the non-uniformity of the substrate as a result of polishing, none have proved to be completely satisfactory.
Method used
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Embodiment Construction
[0023]FIG. 1 depicts one embodiment of a polishing system 100 for polishing a substrate 112 having a polishing fluid delivery system 102 that controls the distribution of polishing fluid 114 across a polishing material 108. Examples of polishing systems which may be adapted to benefit from aspects of the invention are disclosed in U.S. Pat. No. 6,244,935, issued Jun. 12, 2001 to Birang, et al. and U.S. Pat. No. 5,738,574, issued Apr. 14, 1998 to Tolles, et al., both of which are hereby incorporated by reference in their entirety. Although the polishing fluid delivery system 102 is described in reference to the illustrative polishing system 100, the invention has utility in other polishing systems that process substrates in the presence of a polishing fluid.
[0024] Generally, the exemplary polishing system 100 includes a platen 104 and a polishing head 106. The platen 104 is generally positioned below the polishing head 106 that holds the substrate 112 during polishing. The platen 10...
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Abstract
A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher includes flowing polishing fluid to a first portion of the polishing surface through a first outlet while a second portion of the polishing surface adjacent a second outlet receives no flow of polishing fluid, and flowing polishing fluid through the second outlet to the second portion of the polishing surface.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of U.S. patent application Ser. No. 10 / 131,638, filed Apr. 22, 2002, which is hereby incorporated by reference in its entirety. [0002] This application is also related to U.S. patent application Ser. No. 09 / 921,588, filed Aug. 2, 2001, which is hereby incorporated by reference in its entirety.BACKGROUND OF THE INVENTION [0003] 1. Field of the Invention [0004] Embodiments of the invention generally relate to a method and apparatus for distributing fluid in a chemical mechanical polishing system. [0005] 2. Description of the Related Art [0006] In semiconductor wafer processing, the use of chemical mechanical planarization, or CMP, has gained favor due to the enhanced ability to increase device density on a semiconductor workpiece, or substrate, such as a wafer. Chemical mechanical planarization systems generally utilize a polishing head to retain and press a substrate against a polishing surface of a pol...
Claims
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IPC IPC(8): B24B51/00B24B49/00B24C1/00B24B7/30B24B37/04B24B57/02
CPCB24B57/02B24B37/04
Inventor VEREEN, LIDIASKARPELOS, PETER N.DOWNUM, BRIAN J.WILLIAMS, PATRICKKO, TERRY KIN-TINGLEE, CHRISTOPHER HEUNG-GYUNREYNOLDS, KENNETH REESEHEARNE, JOHNHACHNOCHI, DANIEL
Owner APPLIED MATERIALS INC