Apparatus and methods for using a polishing tape cassette

a technology of polishing tape and tape cassette, which is applied in the field of electromechanical device processing, can solve the problems of unsuitable materials building up on the edge of a substrate, and achieve the effect of improving the polishing

Inactive Publication Date: 2009-10-22
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018]In some aspects of the invention, a cassette for housing a polishing tape adapted to polish a substrate. The cassette includes a body portion; and a head portion, wherein the head portion includes: a pair of g

Problems solved by technology

During electronic device manufacturing, undesirable materials may build up on the edge of a substrate.

Method used

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  • Apparatus and methods for using a polishing tape cassette
  • Apparatus and methods for using a polishing tape cassette
  • Apparatus and methods for using a polishing tape cassette

Examples

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Embodiment Construction

[0031]The present invention provides improved methods and apparatus for cleaning and / or polishing an edge of a substrate, for example, before fabrication processes (e.g. deposition and etching processes), are performed. One method of cleaning and polishing a substrate edge (or notch) includes applying an abrasive film or tape (“polishing tape”) to the substrate edge, and moving the polishing tape relative to the substrate edge, while the substrate is fixed in a particular position. The force, or pressure, applied to the polishing tape while contacting the substrate edge, as well as the degree of contact between the polishing tape and the substrate edge, may contribute to polishing efficiency. Another factor that may contribute to polishing efficiency is the degree of movement of the polishing tape relative to the substrate edge. In some embodiments, the relative movement may be provided by advancing the polishing tape over a surface of the substrate edge. However, the degree of rela...

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Abstract

Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.

Description

RELATED APPLICATIONS[0001]The present application claims priority to U.S. Provisional Patent Application No. 61 / 046,453, filed Apr. 21, 2008, and entitled, “APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE” (Attorney Docket No. 11533 / L), which is hereby incorporated herein by reference in its entirety for all purposes.CROSS-REFERENCE TO RELATED APPLICATIONS[0002]The present application is also related to the following commonly-assigned, co-pending U.S. patent applications, each of which is hereby incorporated herein by reference in its entirety for all purposes:[0003]U.S. patent application Ser. No. 11 / 299,295 filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10121);[0004]U.S. patent application Ser. No. 11 / 298,555 filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10414);[0005]U.S. patent application Ser. No. 11 / 693,695 filed on Mar. 29, 2007 and entitled “METHO...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24D17/00B24D99/00
CPCB24B21/004B24B9/065
InventorMANENS, ANTOINE P.ETTINGER, GARY C.BUTTERFIELD, PAUL D.CHANG, SHOU-SUNGMARTINEZ, RICARDOKOLLATA, EASHWEREWALD, ROBERT A.SUMBRIA, KULDIP
OwnerAPPLIED MATERIALS INC