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LED curable liquid resin compositions for additive fabrication

a technology of liquid resin compositions and additive fabrication, applied in the field of photocurable resin compositions, can solve the problems of three-dimensional objects, not fully cured, subjected to post-curing

Inactive Publication Date: 2012-10-11
DSM IP ASSETS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a photocurable resin composition for additive fabrication that can be cured by both free-radical polymerization and cationic polymerization. The composition has a liquid state at room temperature and can be selectively cured by exposing it to light emitted from a LED. The composition has a specific Critical Exposure and Depth of Penetration to ensure proper curing. The invention also provides a three-dimensional article made from the cured photocurable resin composition. The composition is made from bio-based ingredients, which makes it more eco-friendly than traditional petroleum-based compositions.

Problems solved by technology

When initially formed, the three-dimensional object is, in general, not fully cured and therefore may be subjected to post-curing, if required.
The use of bulky and expensive gas lasers to cure liquid radiation curable resins is well known.
However, their output power is limited which reduces the amount of curing that occurs during object creation.
In addition, excess heat could be generated at the point of irradiation which may be detrimental to the resin.
Further, the use of a laser requires scanning point by point on the resin which can be time-consuming.
Although LED lamps are available, photocurable compositions suitable for additive fabrication and curable by the use of LED light are not well known commercially.
Further, the '368 patent fails to disclose the use of an acid generating photoinitiator, such as a cationic photoinitiator.
While the '018 patent and the '186 publication mention UV LEDs and laser diodes as suitable light-emitting centers, they fail to disclose detailed information on photo-activatable building material suitable for LED cure.

Method used

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  • LED curable liquid resin compositions for additive fabrication
  • LED curable liquid resin compositions for additive fabrication
  • LED curable liquid resin compositions for additive fabrication

Examples

Experimental program
Comparison scheme
Effect test

examples 1-56

[0107]These examples illustrate embodiments of the photocurable resin compositions for additive fabrication. Tables 1A-1D describe the various components of the photocurable resin compositions for additive fabrication illustrated in Tables 2-7.

TABLE 1ATrade NameCAS RNFunction in FormulaChemical DescriptorSupplier1-pyrenemethanol24463-15-8Photosensitizing agent1-pyrenemethanolSigma Aldrich9-anthracenemethanol1468-95-7Photosensitizing agent9-(Hydroxymethyl)anthraceneSigma AldrichNK Ester A-DOG87320-05-6Free radical polymerizable[2-[1,1-dimethyl-2-[(1-oxoallyl)oxy]ethyl]-5-ethyl-Kowamonomer or oligomer1,3-dioxan-5-yl]methyl acrylateAnthracene120-12-7Photosensitizing agentAnthraceneSigma AldrichAnthracure UVS 110168818-86-0Photosensitizing agent9,10-Diethoxy-anthracene,Kawaski KaseiBYK A 501proprietary mixtureBubble breakerNaphtha / methoxy propanol acetateBYK-ChemieCD 40667905-41-3Free radical polymerizable1,4-Cyclohexanedimethanol diacrylateSartomermonomer or oligomerCD 53687320-05-6Fre...

example 57

[0108]This Example illustrates some of the properties of the photocurable resin composition for additive fabrication embodiments set forth in Examples 1-56. Tables 8-26 set forth the Dp, Ec, and E3-E5 values and Table 27 sets forth the CPI / RPI and CPC / RPC values.

[0109]The photosensitivity of the compositions are evaluated by measuring Critical Energy (Ec) values, Depth of Penetration (Dp) values, and Storage Shear Modulus (G′) upon exposure to curing light. The Ec and Dp values are measured using a photo cure speed test using LED light (365 nm). The G′ values were measured using a StressTech Rheometer manufactured by Reologicia Instruments AB, Sweden. Each of the methods are summarized below.

[0110]The photo cure speed test using 365 nm LED light is used to measure values for Ec and Dp. A single UV LED “bare bulb” (Model No. NCSUO33A; Nichia Corporation, Japan) having a peak wavelength of 365 nm is used as the LED light source in a light curing apparatus, wherein the single LED light...

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Abstract

Disclosed is a photocurable resin composition for additive fabrication comprising a polymerizable component that is polymerizable by free-radical polymerization, cat ionic polymerization, or both free-radical polymerization and cationic polymerization, and a photoinitiating system capable of initiating the free-radical polymerization, cationic polymerization, or both free-radical polymerization and cationic polymerization. The photocurable resin composition is a liquid at about 25° C., and is capable of curing to provide a solid upon irradiation with light emitted from a light emitting diode (LED), wherein the light has a wavelength of from about 100 nm to about 900 nm. Also disclosed is a three-dimensional article prepared from the photocurable resin composition for additive fabrication, and a process for preparing three-dimensional articles by additive fabrication.

Description

FIELD OF THE INVENTION[0001]The present invention relates to photocurable resin compositions used in additive fabrication applications.BACKGROUND OF THE INVENTION[0002]Additive fabrication processes for producing three dimensional articles are known in the field. Additive fabrication processes utilize computer-aided design (CAD) data of an object to build three-dimensional parts layer-by-layer. These three-dimensional parts may be formed from liquid resins, powders, or other materials.[0003]A non-limiting example of an additive fabrication process is stereolithography (SL). Stereolithography is a well-known process for rapidly producing models, prototypes, patterns, and production parts in certain applications. SL uses CAD data of an object wherein the data is transformed into thin cross-sections of a three-dimensional object. The data is loaded into a computer which controls a laser beam that traces the pattern of a cross section through a liquid radiation curable resin composition...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08F2/50C08J3/28C08G65/18B29C35/08
CPCB29C67/0066B29C2035/0827G03F7/0037G03F7/029G03F7/027G03F7/038G03F7/0045B29C64/245B33Y70/00B29C64/135Y10T428/31515B33Y10/00B33Y30/00B33Y80/00B29C67/0011B29C67/24B29C64/268B29C64/277B29C35/0805B29C64/393B33Y50/02B33Y70/10B33Y40/20B29C2035/0838B29C2033/0005
Inventor DAKE, KENXU, JIGENGBISHOP, TIMOTHY
Owner DSM IP ASSETS BV