Multilayer substrate and a manufacturing method of the multilayer substrate
a manufacturing method and multi-layer substrate technology, applied in the direction of printed circuit stress/warp reduction, inductance, printed electric component incorporation, etc., can solve the problem of large unevenness of the upper or lower surface of the planar coil, and achieve the effect of reducing or preventing the multi-layer substra
Pending Publication Date: 2019-02-21
MURATA MFG CO LTD
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Benefits of technology
The patent aims to improve the quality of multilayer substrates by reducing or eliminating unevenness on their surfaces.
Problems solved by technology
Accordingly, the planar coil is likely to have great unevenness on the upper or lower surface.
Method used
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[0043]Multilayer substrates and manufacturing methods of multilayer substrates according to preferred embodiments of the present invention will hereinafter be described with reference to the drawings.
[0044]The structure of a multilayer substrate according to a preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing the external appearance of multilayer substrates 10, 10a, 10b and 10e. FIG. 2 is an exploded perspective view of the multilayer substrate 10. FIG. 3 is a top transparent view of the multilayer substrate 10. FIG. 3 shows coil patterns 20 and 22, and external electrodes 24 and 26. FIG. 4 is a sectional view of the multilayer substrate 10 along the line A-A in FIG. 3. In the following description, the direction in which layers of the multilayer substrate 10 are stacked on one another will be referred to as an up-down direction. When the multilayer substrate 10 is viewed from the up-side direct...
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Abstract
A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.
Description
CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Japanese Patent Application No. 2016-100033 filed on May 19, 2016 and is a Continuation Application of PCT Application No. PCT / JP2017 / 017125 filed on May 1, 2017. The entire contents of each application are hereby incorporated herein by reference.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to a multilayer substrate and a manufacturing method of the multilayer substrate, and more particularly, to a multilayer substrate including a coil pattern, and a manufacturing method of the multilayer substrate.2. Description of Related Art[0003]As a past invention relating to a conventional multilayer substrate, for example, a planar coil disclosed in Japanese Patent No. 5839535 is known. The planar coil includes two resin layers and two wirings. The two resin layers are stacked on each other in an up-down direction. The two wirings are disposed in the respe...
Claims
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IPC IPC(8): H01F27/28H05K3/18H05K1/16H05K3/46H01F41/04
CPCH01F27/2804H05K3/188H05K1/165H05K3/4661H01F41/043H05K2203/0723H01F2027/2809H01F27/29H05K2201/0154H05K1/0296H05K2203/107H05K3/0032H05K3/4038H05K1/115H01F17/0013H01F27/292H01F41/041H05K1/0271H05K3/241H05K3/4644
Inventor MURAOKA, KAZUTAKAYOSUI, KUNIAKIITO, YUKIGOUCHI, NAOKI
Owner MURATA MFG CO LTD