Retaining ring design

a technology of retaining rings and rings, applied in the direction of work carriers, electrical appliances, basic electric elements, etc., can solve the problem that the retaining rings may be biased unpredictably in the upward or downward direction

Pending Publication Date: 2022-10-27
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The design minimizes planar non-uniformities in substrates by providing a predictable and uniform mechanical bias, ensuring consistent material removal profiles across the substrate surface during the CMP process.

Problems solved by technology

However, with current CMP apparatus, the substrate may be biased unpredictably in an upward or downward direction at contact points within the carrier head.

Method used

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  • Retaining ring design
  • Retaining ring design
  • Retaining ring design

Examples

Experimental program
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Embodiment Construction

[0020]Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

[0021]FIG. 1 is a bottom side perspective view of a retaining ring 100. The retaining ring 100 of FIG. 1 is shown with the polishing pad facing side oriented upward for ease of description. In operation, the polishing pad facing side is typically oriented downward during polishing of a substrate. The retaining ri...

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Abstract

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. Non-Provisional patent application Ser. No. 16 / 149,939, filed Oct. 2, 2018, which claims benefit of U.S. Provisional Patent Application Ser. No. 62 / 567,971, filed Oct. 4, 2017, which are herein incorporated by reference in their entirety.BACKGROUNDField[0002]Embodiments of the present disclosure generally relate to a retaining ring for use with polishing devices.Description of the Related Art[0003]Chemical mechanical polishing (CMP) is one process commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a substrate. A carrier head provides the substrate retained therein to a polishing station of a polishing system and controllably urges the substrate against a moving polishing pad. CMP is effectively employed by providing contact between a feature side of the substrate and moving the substrate relative to the polishing pad while ...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): B24B37/32H01L21/687
CPCB24B37/32H01L21/687
InventorOH, JEONGHOONGARRETSON, CHARLES C.LAU, ERICNAGENGAST, ANDREWZUNIGA, STEVEN M.SUAREZ, EDWIN C.ZHANG, HUANBOBROWN, BRIAN J.
OwnerAPPLIED MATERIALS INC