The invention relates to a method for sealing a substrate, comprising at least steps 1) and 3), a
solvent-based composition is at least partially applied to the surface of the substrate in order to at least partially form a film (1) on said surface), a
sealant composition is at least partially applied to the film obtained after step 1) in order to form a
sealant film (3), wherein the
sealant composition is obtainable by mixing at least two components A) and B) of a sealing
system, which are present separately, with one another, the
solvent-borne composition applied in step 1) comprising at least two different alcohols as organic solvents in an amount of at least 85.0 wt.-%, based on the total weight of the composition, as component a1), the invention relates to a method for producing a
solvent-borne composition, comprising, as component a1), at least one organometallate, the
metal of which is selected from Ti and Zr, as component a2), and at least one organosilane, as component a3), in an amount of at most 10.0 wt.-%, based on the total weight of the composition, sealing substrates obtainable by the method, the use of the solvent-borne composition as an adhesion-promoting composition, the solvent-borne composition itself, as an adhesion-promoting composition, the solvent-borne composition comprising, as component a2), at least one organometallate, the
metal of which is selected from Ti and Zr, and at least one organosilane, as component a3). The invention also relates to a kit set containing the solvent-based composition.