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5 results about "Metallate" patented technology

Metallate is the name given to any complex anion containing a metal ligated to several atoms or small groups. The spelling metalate is almost as common. Typically, the metal will be one of the transition elements and the ligand will be oxygen or another chalcogenide or a cyanide group (though others are known). The chalcogenide metallates are known as oxometallates, thiometallates, selenometallates and tellurometallates; the cyanide metallates are known as cyanometallates.

Adhesion promoter for polysulfide and polythioether-based sealants

The invention relates to a method for sealing a substrate, comprising at least steps 1) and 3), by applying at least part of a solvent-based composition to a surface of the substrate to at least part form a film (1) on said surface, applying at least part of a sealant composition to the film obtained after step 1) to form a sealant film (3), wherein the sealant composition is obtainable by mixing at least two components A) and B) of a sealing system, which are present separately, with one another, the solvent-borne composition applied in step 1) comprising at least one aliphatic hydrocarbon as an organic solvent component a1) in an amount of at least 70.0 wt.-%, based on the total weight of the composition, at least one organometallate as component a2) in an amount of at least 70.0 wt.-%, based on the total weight of the composition, the present invention relates to a method for preparing a solvent-borne composition comprising at least one metal acid salt, the metal of which is selected from Ti and Zr, and at least one organosilane as component a3), sealing substrates obtainable by this method, the use of this solvent-borne composition as an adhesion promoting composition, the solvent-borne composition itself, and a kit comprising said solvent-borne composition.
Owner:CHEMETALL GMBH

Methods for patterning a semiconductor substrate using metalate salt ionic liquid crystals

Embodiments of improved process flows and methods are provided to pattern a semiconductor substrate using direct self-assembly (DSA) of metalate salt ionic liquid crystals (ILCs) having metalate anions. After self-assembly of the metalate salt ILCs into ordered structures, an oxidation process is used to remove the organic components of the ordered structures and convert the metalate anions into metal oxide patterns. In addition to providing a robust metal oxide pattern, which can be transferred to the underlying substrate, the process flows and methods disclosed herein enable ILCs to be used as pitch multipliers in advanced patterning techniques.
Owner:TOKYO ELECTRON LTD

Method of patterning semiconductor substrate using metallate ion liquid crystal

Embodiments of improved process flows and methods are provided to use directed self-assembly (DSA) of metallate ion liquid crystals (ILC) with metallate anions to pattern a semiconductor substrate. After the metallate ILC is self-assembled into an ordered structure, an oxidation process is used to remove organic components of the ordered structure and convert the metallate anions into a metal oxide pattern. In addition to providing a robust metal oxide pattern that can be transferred to an underlying substrate, the process flows and methods disclosed herein enable ILC to be used as a pitch multiplication means in advanced patterning techniques.
Owner:TOKYO ELECTRON LTD

Adhesion promoter for polysulfide and polythioether-based sealants

The invention relates to a method for sealing a substrate, comprising at least steps 1) and 3), a solvent-based composition is at least partially applied to the surface of the substrate in order to at least partially form a film (1) on said surface), a sealant composition is at least partially applied to the film obtained after step 1) in order to form a sealant film (3), wherein the sealant composition is obtainable by mixing at least two components A) and B) of a sealing system, which are present separately, with one another, the solvent-borne composition applied in step 1) comprising at least two different alcohols as organic solvents in an amount of at least 85.0 wt.-%, based on the total weight of the composition, as component a1), the invention relates to a method for producing a solvent-borne composition, comprising, as component a1), at least one organometallate, the metal of which is selected from Ti and Zr, as component a2), and at least one organosilane, as component a3), in an amount of at most 10.0 wt.-%, based on the total weight of the composition, sealing substrates obtainable by the method, the use of the solvent-borne composition as an adhesion-promoting composition, the solvent-borne composition itself, as an adhesion-promoting composition, the solvent-borne composition comprising, as component a2), at least one organometallate, the metal of which is selected from Ti and Zr, and at least one organosilane, as component a3). The invention also relates to a kit set containing the solvent-based composition.
Owner:CHEMETALL GMBH

Ir-based high-entropy alloy oxygen evolution catalyst and preparation method and application thereof

The application provides an Ir-based high-entropy alloy oxygen evolution catalyst and a preparation method and application thereof, and belongs to the field of high-entropy alloy catalysts. The preparation method can efficiently and simply construct the Ir-based high-entropy alloy oxygen evolution catalyst with high activity, high stability, uniform particle size and uniform distribution. Since the formation of the HEA particle is autocatalytic, i.e. the initially formed metal nucleus catalyzes the further reduction of the solvated metal salt, different metal atoms can be deposited and mixed in the growth process, so that the noble metal Ir and the remaining metals are co-reduced, thereby forming a small-particle-size high-entropy alloy. The high-entropy alloy prepared by the application has a nanosphere shape, the nanosphere particles are dispersed and the element distribution is uniform, and the crystal structure has a similar structure to that of pure Pd, so that the problems of low mass activity and poor stability of the high-entropy alloy catalyst under the acidic working conditions of the PEM anode area can be solved.
Owner:TIANJIN UNIV +1