The invention discloses a step thick
copper embedded heat dissipation substrate and a
processing method thereof, and the
processing method comprises the steps:
processing an outer layer thick
copper foil of the substrate into a step structure composed of a thin
copper region and a thick copper region, and manufacturing an inner layer circuit on the thin copper region; pasting a first photosensitive insulating layer on the step structure, and then exposing and developing to form a first hole and a second hole of which the inner wall roughness is not greater than 5 [mu] m on the first photosensitive insulating layer; a
chip is fixedly arranged on the part, exposed out of the first hole, of the thick copper area; and covering the first photosensitive insulating layer and the
chip with a second photosensitive insulating layer, forming an outer circuit connected with the
chip pin on the second photosensitive insulating layer, and forming a first connecting copper body connected with the inner circuit and the outer circuit in the second hole, thereby obtaining the stepped thick copper embedded heat dissipation substrate. The
machining method is high in
machining efficiency and precision and low in
machining cost, and the obtained heat dissipation substrate is high in heat dissipation performance, high in circuit pattern
fineness and small in
signal loss and meets production requirements.