2results about How to "The preparation method is reasonable" patented technology

The application discloses a kind of buried copper block circuit board and its manufacturing method, the manufacturing method includes: the two outer layers of core plate are copper foil layer, and window position A is provided on the non-line area of one outer layer;Core plate is double-sided inner layer pattern production, to make inner layer circuit pattern and pad on the two outer layers of core plate respectively, and make a plurality of flow blockings on one outer layer of core plate, which are surrounded outside window position A;The insulating layer is covered on the two outer layers of core plate, and window position B is provided on the insulating layer adjacent to flow blocking, which is opposite to window position A;Based on window position, insulating layer and core plate are windowed;After the copper block gap with rough surface is placed in window, it is compressed and handled, and in the process of compression, the flow of colloid in window is controlled by flow blocking, so that copper block is firmly combined with insulating layer and core plate together.The manufacturing method is simple and reasonable, easy to implement, the reliability and stability of the obtained circuit board product are high, and the market demand is met.