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Chip pressing structure and its shaping method and electronic installation

A technology for electronic devices and chips, which is applied to circuits, electrical components, electrical solid devices, etc., can solve the problems of difficult to catch conductive particles, insufficient number of conductive particles, and low capture rate of conductive particles 113.

Inactive Publication Date: 2007-10-24
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip 101 and the substrate 105 are pressed together, the insulating glue of the anisotropic conductive film 109 is squeezed by the metal bump 103 and flows toward the outside of the chip 103, and the conductive particles 113 will follow the pressure of the insulating glue of the anisotropic conductive film 109. and the bottom of the flat metal bump 103 is not easy to catch conductive particles, so the capture rate of the metal bump 103 for the conductive particles 113 is quite low, resulting in insufficient number of conductive particles captured by the metal bump 103 and the bonding pad 107 , while reducing component performance

Method used

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  • Chip pressing structure and its shaping method and electronic installation
  • Chip pressing structure and its shaping method and electronic installation
  • Chip pressing structure and its shaping method and electronic installation

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Embodiment Construction

[0019] Fig. 3 is the chip bonding structure of the electronic component of the comparative example of the present invention, and the chip bonding structure of the drive IC in the liquid crystal display is taken as an example here, showing the structural diagram before the bonding, including: a chip 301 with a plurality of metal bumps 303, wherein the metal bump 303 is a pillar and is perpendicular to the surface of the chip 301. Its material can be a general conductive material, preferably including gold, copper, aluminum or their alloys. The bonding surface of the metal bump 303 has a groove 311 A substrate 305, which can be, for example, a semiconductor substrate, an organic material substrate, a transparent substrate or a glass substrate, has a plurality of bonding pads 307, wherein the bonding pads are a conductive material for electrical connection with the metal bump 303; an anisotropic The conductive film 309 has a plurality of conductive particles 313 and is formed betw...

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Abstract

A bonding structure of chips includes a base plate with multiple connection pads on the surface of the base plate, a chip set opposite to the plate with multiple metallic convex blocks for joining with said pads, in which, the connection face of the convex block has a notch with a gap on its sidewall and an anisotropy conduction film set between the base plate and the chip for connecting the chip and the binding pad.

Description

technical field [0001] The invention relates to a chip pressing structure, in particular to a chip pressing structure capable of improving the capture rate of conductive particles. Background technique [0002] Chip on glass (COG) is an advanced technology for electrical connection of integrated circuits. It has the advantages of light weight, small size, low cost, and low power consumption. It has been used in various lamination productions. The electrical connection between the driver IC and the glass substrate will affect its quality and reliability. At present, the material widely used to connect the chip to the LCD glass substrate of the liquid crystal display is anisotropic conductive film (ACF), which is made of a thickness of 15 - 35 μm insulating glue and conductive particles with a diameter of about 3-15 μm, wherein the insulating glue can be a thermoplastic material, a thermosetting material or a mixture of thermoplastic and thermosetting materials. The conductiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/0401H01L2224/05554H01L2224/10
Inventor 黄清育周诗频李俊右
Owner AU OPTRONICS CORP