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Method of resetting substrate processing apparatus, storing program and substrate processing apparatus

A substrate processing device and recovery method technology, applied in the direction of program control, ion implantation plating, gaseous chemical plating, etc., can solve the problems of time-consuming, inability to ensure normal model universality, inability to eliminate P/C work efficiency, etc. , to achieve the effect of preventing the reduction of work efficiency

Active Publication Date: 2008-06-25
TOKYO ELECTRON LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, in the method of monitoring the output of the above-mentioned high-frequency power supply to detect the abnormality of P / C, it is necessary to perform multivariate analysis. Since the selection method of measurement data using the normal model has not been established, there is a problem of inability to set the threshold value. To ensure the universality of the normal model, it is impossible to accurately determine the abnormality of P / C
[0009] In addition, since each measurement data is normalized in the multivariate analysis, the value of the multivariate analysis result is not an absolute value
When an arbitrary multivariate analysis result is set as a threshold value, it is difficult for the operator to know the influence of the fluctuation of each measurement data on the multivariate analysis result because the value of the multivariate analysis result is not an absolute value.
As a result, because the operator's subjective will is added to the threshold setting, the universality of the normal model cannot be ensured, and there is a problem that the abnormal judgment of P / C cannot be accurately performed.
[0010] Also, since the environment inside the chamber changes before and after maintenance, it is necessary to reset the normal model at the time of maintenance, and as a result, there is a problem that the work efficiency of the P / C cannot be eliminated due to time-consuming

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  • Method of resetting substrate processing apparatus, storing program and substrate processing apparatus
  • Method of resetting substrate processing apparatus, storing program and substrate processing apparatus
  • Method of resetting substrate processing apparatus, storing program and substrate processing apparatus

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Embodiment Construction

[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0061] First, a substrate processing apparatus according to an embodiment of the present invention will be described.

[0062] figure 1 is a schematic cross-sectional view showing the configuration of a processing chamber as a substrate processing apparatus according to the present embodiment.

[0063] exist figure 1 Among them, a processing chamber (hereinafter referred to as "P / C") 2 constituted as an etching processing apparatus for etching a semiconductor wafer has a cylindrical chamber 10 made of metal, such as aluminum or stainless steel. In this chamber 10, for example, a lower electrode 11 serving as a stage on which a semiconductor wafer having a diameter of 200 mm is placed is disposed.

[0064] Between the side wall of the chamber 10 and the lower electrode 11 is formed an exhaust path 12 that functions as a flow path for exhausting gas above the lower ele...

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Abstract

A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.

Description

technical field [0001] The present invention relates to a recovery method of a substrate processing device, a recovery program of a substrate processing device, and a substrate processing device, in particular to a recovery method and a recovery program of a substrate processing device after maintenance. Background technique [0002] Generally, a substrate processing system that performs predetermined processing such as film formation processing and etching processing on a semiconductor wafer (hereinafter referred to as "wafer") as a substrate includes a processing chamber (substrate processing apparatus, Hereinafter referred to as "P / C"); an atmospheric transfer device that takes out wafers from a wafer cassette that is an airtight container that accommodates a predetermined number of wafers; It is a load lock chamber for loading and unloading wafers between the transport device and the P / C. [0003] In such a substrate processing system, the P / C has a cylindrical containe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/20H01L21/3065H01L21/31H01L21/311H01L21/3205H01L21/3213G05B19/048C23C14/22C23C16/44C23F4/00H01J37/32
Inventor 古家元田中秀树大久保智也小林凉子
Owner TOKYO ELECTRON LTD
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