Method of resetting substrate processing apparatus, storing program and substrate processing apparatus
A substrate processing device and recovery method technology, applied in the direction of program control, ion implantation plating, gaseous chemical plating, etc., can solve the problems of time-consuming, inability to ensure normal model universality, inability to eliminate P/C work efficiency, etc. , to achieve the effect of preventing the reduction of work efficiency
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[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0061] First, a substrate processing apparatus according to an embodiment of the present invention will be described.
[0062] figure 1 is a schematic cross-sectional view showing the configuration of a processing chamber as a substrate processing apparatus according to the present embodiment.
[0063] exist figure 1 Among them, a processing chamber (hereinafter referred to as "P / C") 2 constituted as an etching processing apparatus for etching a semiconductor wafer has a cylindrical chamber 10 made of metal, such as aluminum or stainless steel. In this chamber 10, for example, a lower electrode 11 serving as a stage on which a semiconductor wafer having a diameter of 200 mm is placed is disposed.
[0064] Between the side wall of the chamber 10 and the lower electrode 11 is formed an exhaust path 12 that functions as a flow path for exhausting gas above the lower ele...
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