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Pattern evaluation method, pattern splicing method and computer readable media

A technology for pattern evaluation and evaluation objects, applied to measuring devices, instruments, etc., can solve the problems of difficulty in comparing the degree of pattern consistency, unclear threshold, and rising cost of pattern shape evaluation

Inactive Publication Date: 2008-08-13
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] First of all, the overlap between the outline of the evaluation target pattern and the CAD drawing depends on the shape of the pattern, so it is difficult to compare the degree of coincidence between patterns of different shapes
In addition, since two types of image processing, image comparison and pattern difference calculation, need to be continuously performed, there is a problem that it takes time for calculation and increases the cost of pattern shape evaluation.
In addition, there is no clear standard for the threshold value used in image matching, and the current status is that its setting depends on the operator's experience

Method used

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  • Pattern evaluation method, pattern splicing method and computer readable media
  • Pattern evaluation method, pattern splicing method and computer readable media
  • Pattern evaluation method, pattern splicing method and computer readable media

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no. 2 Embodiment approach

[0091] In the aforementioned first embodiment, the degree of matching S between the evaluation target pattern and the reference pattern is calculated. However, in the method described in this embodiment, in addition to calculating the above-mentioned matching degree S, the array D is converted into an image and superimposed on the display. On the inspection object, thereby visually displaying the degree to which the pattern of the evaluation object matches its design pattern and how (inconsistent) it is.

[0092] As described in the above-mentioned first embodiment, since the array data D is substituted into the distance value as an element, it cannot be directly displayed as an image. In addition, since the contour is detected with an accuracy of 1 / 10 pixel, it cannot be simply superimposed directly on the inspection image. Therefore, the array is divided into units of 10×10 areas to define pixels, the sum of the areas is converted into an 8-bit integer value, and image conve...

no. 3 Embodiment approach

[0095] It is easy to generalize image data as array data. In order to simplify the description below, array data is used as image data. Thus, the pointer coordinates of the array are expressed as pixel coordinates of the image, and the array values ​​are expressed as grayscale values ​​of the image. And, design data is realized as a design pattern in advance.

[0096] In the above-mentioned first and second embodiments, the relative positions of the evaluation target pattern and the design pattern are determined by normalized correlation method, etc., and the degree of shape consistency of the positional relationship is evaluated. However, for example, the elements of the array D may be One or more values ​​obtained by the total S and so on are compared with a certain reference to find the most suitable positional relationship. Therefore, the relative positions of the evaluation target pattern and the design pattern are scanned, and the steps described in the above-mentioned...

no. 7 Embodiment approach

[0111] refer to Figure 10 ~ Figure 15 A seventh embodiment of the present invention will be described. This embodiment is characterized in that a reference pattern serving as a pattern providing an evaluation criterion for an evaluation target pattern and a parameter called an allowable value are prepared in advance, and the allowable range of the evaluation target pattern (also called "evaluation pattern shape value") is generated using them. Allowable range"), according to the obtained allowable range and the inclusion relationship of the evaluation object pattern, determine whether the evaluation object pattern is qualified or not.

[0112] Figure 10 It is a figure which shows the partial outline of the pattern P2 which is an example of the evaluation object pattern, Figure 11 yes means Figure 10 A plot of the partial profile of the reference pattern RP2 for the pattern P2 shown. In the present embodiment, the reference pattern RP2 is a design pattern based on the d...

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Abstract

A pattern evaluation method includes: generating first array data from edge data on a pattern to be evaluated, the edge data on the pattern to be evaluated being shape data including edge points of the pattern to be evaluated; generating second array data from edge data on a reference pattern, the edge data on the reference pattern including edge points of the reference pattern which serves as an inspection standard of the pattern to be evaluated; subjecting each component of the second array data to array conversion processing, the array conversion processing being designed to convert a value of the component of the second array data into a function value of a value of a distance from that component to the edge point closest thereto, thereby generating third array data; executing arithmetic processing between the first array data and the third array data to generate fourth array data; and using a component of the fourth array data to calculate a numerical value representative of an relation between the pattern to be evaluated and the reference pattern.

Description

[0001] This application claims priority based on Japanese Patent Applications No. 2005-099052 and No. 2005-098513 filed on March 30, 2005, and the contents thereof are hereby incorporated by reference. technical field [0002] The invention relates to a pattern evaluation method, a pattern alignment method and a program. Background technique [0003] In various industrial fields, a method of evaluating the shape of a pattern to be evaluated (hereinafter referred to as pattern to be evaluated) using a difference from a reference pattern as an index is widely used. For example, in the evaluation of device patterns of semiconductors, as the inspection object of the pattern, using SEM (scanning electron microscope) image and CAD (computer-aided design) data as its design data, the similarity of the processed shape of the device pattern to its designed shape is calculated Degree, so as to judge whether the pattern is qualified or not. An example of such a conventional evaluation...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/20
Inventor 三井正
Owner KK TOSHIBA
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