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Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate

A technology of circuit substrate and recycling method, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., and can solve problems such as the inability to provide a comprehensive and complete solution, difficult distribution of connecting pieces on circuit boards, and errors in the recycling process.

Inactive Publication Date: 2009-09-09
TOPOINT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the more special the shape of the circuit board is, the more difficult it is for the distribution of the connection pieces to be taken out and put back into the bonded circuit board by precise positioning on a general process machine. This will not only easily lead to errors in the recycling process, but also A lot of time will be wasted in accurately searching for multiple scattered connection pieces in the process machine
If due to the special shape of the circuit boards, the industry is unwilling to recycle due to the time and cost of the recycling process, it will happen again that such circuit board products are discarded if they are defective. This will not only waste resources, but also cause many The garbage problem on waste disposal has caused a great burden on society
[0006] The known technology related to the rapid recycling of circuit boards is only for regular-shaped circuit boards, but it may not be able to provide a comprehensive and complete solution for the recycling process of special-shaped circuit boards today.

Method used

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  • Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate
  • Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate
  • Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate

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Embodiment Construction

[0051] see figure 1 and figure 2 , figure 1 It is a flowchart of a preferred embodiment of the present invention, figure 2 It is a perspective view of a preferred embodiment of the present invention Figure 1 . The present invention relates to a method for quickly recovering circuit boards. First, a plurality of first positioning holes 10 on a first circuit board 1 are searched for, and then a cutting device (not shown) is positioned through the first positioning holes 10. The module performs a positioning search, wherein the cutting device can be equipped with a precision control system (not shown in the figure), such as a CNC system (Computer Numerical Control), and at least one photographic lens (not shown in the figure) can be configured, and the photographic lens can be One of the following devices: CMOS lens, CCD lens, Super CCD lens or VPS lens, for fast and accurate positioning search, in addition, the cutting device can be one of the following devices: CNC proce...

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Abstract

The invention provides a method for quick recovery of circuit boards, which is not only applicable to circuit boards with regular shapes such as squares, but also to circuit boards with special shapes such as circles, parabolas, and irregular shapes. The simple cutting method can quickly remove the circuit board from the circuit substrate, so it can save the time spent on the work machine for multiple searches and positioning due to the complicated distribution of the connecting pieces, and can effectively avoid the distribution of the connecting pieces The resulting cutting or bonding errors can greatly improve the yield rate of the circuit board recycling process.

Description

technical field [0001] The invention is applied to the recycling process of circuit boards, especially for rapid cutting and bonding of circuit boards with special shapes, so as to achieve the purpose of recycling good-quality circuit boards. Background technique [0002] The common circuit board (panel) in the industry contains several circuit boards. If the circuit board contained in the circuit board is found to be defective during the circuit board manufacturing process, the circuit board will be scrapped, resulting in other good circuit boards on the circuit board. At the same time, in order to make up for the amount of scrapped circuit substrates, it is necessary to re-produce the circuit substrates to achieve the target output. In order not to cause waste and save the time and cost required to re-produce circuit boards, many related inventions have been disclosed. A method for manufacturing a circuit board, the method comprising: (a) simultaneously manufacturing a pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K3/00H05K1/02
Inventor 颜陈祥
Owner TOPOINT TECH