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Double-plate box of multi-motherboard system

A motherboard and board machine technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as impossible heat dissipation effects

Inactive Publication Date: 2009-11-11
HUANDA COMPUTER (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, when the size of the fan or the length of the cooling fins is increased, the width of the chassis 100 will be relatively increased. Therefore, under this structure, it is less likely to increase the cooling effect by increasing the size of the cooling fins 111

Method used

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  • Double-plate box of multi-motherboard system
  • Double-plate box of multi-motherboard system
  • Double-plate box of multi-motherboard system

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Embodiment Construction

[0022] Specific embodiments are listed below to describe the content of the present invention in detail, and illustrations are used as auxiliary descriptions. The symbols mentioned in the description refer to the symbols of the drawings.

[0023] refer to figure 2 and image 3 , the dual-board chassis of the multi-mainboard system of the present invention includes a tubular housing 200 , two rail sets 210 and two mainboard trays 230 . The tubular housing 200 of this two-board chassis is ready for installation in Figure 6 The main chassis 300 of the multi-main board system.

[0024] The roughly rectangular tubular casing 200 has two opposite open ends, which can be formed by combining two U-shaped plates, or by combining two bent ends of a single plate.

[0025] Each rail set 210 includes: two rails 212, 214, respectively disposed on the top side and the bottom side inside the tubular housing 200, extending towards the open end of the tubular housing 200; that is, the rai...

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Abstract

A dual-board chassis for a multi-mainboard system adopts a rectangular tubular shell, and two mainboard trays are movably arranged on both sides of the tubular shell by means of two track groups, and the mainboard tray is used for The load-bearing surfaces of the motherboards are opposite to each other, so that the system can be configured in a better space, and achieve the best heat dissipation efficiency and greatly reduce noise at the same time.

Description

【Technical field】 [0001] The invention relates to a case, in particular to a double-board case of a multi-main board system. 【Background technique】 [0002] The highly modular nature of the Blade Architecture brings the advantages of high density, convenient management, easy expansion, and suitability for special applications to the blade server; generally speaking, the Blade Architecture is a high-performance computing (High Performance Computing, HPC) One of the best options for the system. However, since high-performance computing systems generate more heat than general systems, the high-density blade architecture is not conducive to providing high heat dissipation efficiency. At present, some systems use a liquid cooling system with high heat dissipation efficiency. Although the heat dissipation efficiency is effectively improved, it also increases the cost and the manufacturing complexity. [0003] Such as figure 1 Shown is a personal supercomputer using a blade arch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 莫辰尔李俊宏
Owner HUANDA COMPUTER (SHANGHAI) CO LTD