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Double-plate box of multi-motherboard system

A motherboard and board machine technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as impossible heat dissipation effects

Inactive Publication Date: 2008-06-11
HUANDA COMPUTER (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, when the size of the fan or the length of the cooling fins is increased, the width of the chassis 100 will be relatively increased. Therefore, under this structure, it is less likely to increase the cooling effect by increasing the size of the cooling fins 111

Method used

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  • Double-plate box of multi-motherboard system
  • Double-plate box of multi-motherboard system
  • Double-plate box of multi-motherboard system

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Embodiment Construction

[0022] Specific embodiments are listed below to describe the content of the present invention in detail, and illustrations are used as auxiliary descriptions. The symbols mentioned in the description refer to the symbols of the drawings.

[0023] Refer to Figure 2 with image 3 , the dual-board chassis of the multi-mainboard system of the present invention includes a tubular housing 200 , two rail sets 210 and two mainboard trays 230 . The tubular casing 200 of the dual-board chassis can be installed in the main casing 300 of the multi-board system shown in FIG. 6 .

[0024] The roughly rectangular tubular casing 200 has two opposite open ends, which can be formed by combining two U-shaped plates, or by combining two bent ends of a single plate.

[0025] Each rail set 210 includes: two rails 212, 214, respectively disposed on the top side and the bottom side inside the tubular housing 200, extending towards the open end of the tubular housing 200; that is, the rails 212, 214...

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Abstract

A double plate chassis of a multiple mainboard system is provided, which adopts a rectangular tube shell, movably positions two mainboard tray at internal two sides of the tube shell by utilizing two path groups, facilitating bearing surfaces of the mainboard tray supported the mainboard being opposite to one another, so as to make sure that the system can be formed with better space collocation and realize excellent radiation efficiency as well as greatly lower noise.

Description

【Technical field】 [0001] The invention relates to a case, in particular to a double-board case of a multi-main board system. 【Background technique】 [0002] The highly modular nature of the Blade Architecture brings the advantages of high density, convenient management, easy expansion, and suitability for special applications to the blade server; generally speaking, the Blade Architecture is a high-performance computing (High Performance Computing, HPC) One of the best options for the system. However, since high-performance computing systems generate more heat than general systems, the high-density blade architecture is not conducive to providing high heat dissipation efficiency. At present, some systems use a liquid cooling system with high heat dissipation efficiency. Although the heat dissipation efficiency is effectively improved, it also increases the cost and the manufacturing complexity. [0003] like figure 1 Shown is a personal supercomputer using a blade archite...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
Inventor 莫辰尔李俊宏
Owner HUANDA COMPUTER (SHANGHAI) CO LTD