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Heat pipe radiator

A technology of heat dissipation device and heat pipe, applied in the direction of tubular elements, indirect heat exchangers, heat exchange equipment, etc., can solve the problems of affecting the heat dissipation effect, slow heat transfer speed, unstable CPU operation, etc., to shorten the heat transfer path and reduce heat dissipation. Better performance and weight savings

Inactive Publication Date: 2008-01-02
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the size of the CPU becomes smaller and its performance improves faster, the heat it emits becomes more concentrated. Because the heat transfer performance of the metal is limited, the heat at the center of the base is often too concentrated and cannot be effectively transferred to the surroundings of the heat sink. , and the heat transfer speed is slow, which affects the overall heat dissipation effect, making the CPU run unstable and unable to operate effectively

Method used

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  • Heat pipe radiator
  • Heat pipe radiator
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Examples

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Embodiment Construction

[0013] Please refer to Fig. 1 to Fig. 4, the heat pipe heat dissipation device of the present invention is used to dissipate heat to heat-generating electronic components, including a substrate 40, a first heat dissipation fin group 80 disposed on the substrate 40 and distributed between the first heat dissipation fin group 80 and the first heat dissipation fin group 80. There are two second heat dissipation fin groups 90 on both sides of the substrate 40 , and the device also includes several heat pipes 20 connecting the substrate 40 and the first and second heat dissipation fin groups 80 , 90 .

[0014] The substrate 40 includes a body portion 48 for heat conduction and two fixing portions 44, 46 extending from opposite sides of the body portion, wherein the fixing portion 44 has the same width as the body portion 48, and the fixing portion 46 is wider than the body portion 48, thereby form a T-shaped structure. Both fixing parts 44 and 46 are provided with holes for fixing....

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PUM

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Abstract

A heat pipe heat radiator comprises a baseboard, a first radiation fin group and at least one heat pipe arranged on the baseboard, wherein the heat pipe is connected with a first heat radiation fin group and a baseboard, at least one side of the first heat radiation fin group is provided with a second heat radiation fin group extended to one side of the baseboard and sheathed on the heat pipe. The inventive heat radiator distributes the second heat radiation fin group on at least one side of the baseboard, to optimize heat radiation and reduce weight.

Description

technical field [0001] The invention relates to a heat pipe cooling device, in particular to a heat pipe cooling device capable of effectively cooling electronic components. Background technique [0002] With the rapid development of the electronic industry, the calculation speed of electronic components such as central processing units has been greatly increased, and the heat generated by them has also increased sharply, which seriously threatens the performance of electronic components during operation. How to dissipate heat from electronic components is crucial to ensure their normal operation. In order to effectively dissipate the heat generated by the CPU during operation, the industry usually installs a heat sink on the surface of the CPU to assist in heat dissipation, so that the temperature of the CPU itself can be maintained within a normal operating range. [0003] Traditional heat dissipation devices all include a heat dissipation body. The heat dissipation body ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427G12B15/06
CPCF28F1/32F28D15/0275
Inventor 罗文礼周世文陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN