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A condenser microphone and method of making the same

A technology of a condenser microphone and a manufacturing method, which is applied in the directions of electrostatic transducer microphones, sensors, electrical components, etc., can solve problems such as sound quality degradation, influence of product shape or sound characteristics, tolerances, etc.

Inactive Publication Date: 2008-01-16
BSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such a curling method of pressing one end of the case (11) toward the PCB (18) side while winding it to bend it has the following problems: due to the pressure during the process and the tolerance of the parts, the affect the shape or sound characteristics of the final product
That is, when the pressing force in the crimping process is insufficient, the sound pressure leaks between the case and the PCB, and the sound quality deteriorates. In this case, the sound characteristic is distorted, a defective product is produced, or an electrical disconnection occurs. The product itself does not work
In addition, if the pressing force is too large when curling, the curled surface will be damaged, or the internal parts will be deformed, resulting in distortion of sound characteristics

Method used

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  • A condenser microphone and method of making the same
  • A condenser microphone and method of making the same
  • A condenser microphone and method of making the same

Examples

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no. 1 example

[0027] Fig. 2 is a side sectional view showing a microphone of the present invention having a structure in which a sound hole is formed in a housing and a general conductive base is used.

[0028] As shown in Figure 2, the condenser microphone (100) of the present invention is manufactured by the following manner, that is, the following parts are inserted in sequence in the housing (102) of metal material that is formed with sound hole (102a) on the bottom surface: vibrating plate (104) , which consists of a pole ring (104a) formed of a conductive material and a vibrating membrane (1104b); a spacer (106); an insulating base (108) formed of an insulating material; a back plate (110) , which is opposed to the vibrating plate (104) with a spacer (106); and a conductive base (112), which is formed of a conductive material, and then, the end portion of the housing (102) is pre-welded (130) to the PCB (120 ) and bonded with an adhesive (140). In this case, in the case of an electre...

no. 2 example

[0036] Fig. 4 is a side sectional view showing a microphone of the present invention having a structure in which a sound hole is formed in a housing and a spring-shaped conductive base is used.

[0037] As shown in FIG. 4, the condenser microphone (200) of the present invention is manufactured by sequentially laminating in a metal case (102) in which a sound hole (102a) is formed on the front plate and a linear end portion is formed. The following components: a vibrating plate (104), which is composed of a pole ring (104a) and a vibrating membrane (104b), and the pole ring (104a) is formed of a conductive material; a spacer (106); an insulating base (108), which is made of an insulating Material is formed; Backplate (110), it is opposite with spacer (106) with vibrating plate (104); And conductive base (202), it is formed by the spring of metal material, then, the end of housing (102) Parts are pre-soldered (130) to the PCB (120), bonded with adhesive (140).

[0038] Moreover...

no. 3 example

[0043] Fig. 5 is a side sectional view showing a microphone of the present invention having a structure in which a sound hole is formed in a housing and a conductive meson is used in a conductive base.

[0044] As shown in FIG. 5 , the condenser microphone (300) of the present invention is manufactured by sequentially stacking a sound hole (102a) on the front plate and a metal housing (102) whose end portion is formed in a linear shape. The following components: a vibrating plate (104), which is composed of a pole ring (104a) and a vibrating membrane (104b), and the pole ring (104a) is formed of a conductive material; a spacer (106); an insulating base (108), which is made of an insulating The material is formed; the back plate (110), which is opposed to the vibrating plate (104) with a spacer (106); the conductive meson (302), which is used to better connect the conductive base to the PCB; and the conductive base made of metal (112) Then, the end portion of the housing (102) ...

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Abstract

Disclosed are a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone. The manufacturing method comprises the steps of inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened, aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack- welding, and curing the adhesive. The metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case.

Description

technical field [0001] The present invention relates to a condenser microphone, and more particularly, the present invention relates to a condenser microphone having a structure in which a casing and a PCB are bonded with an adhesive after pre-welding and a manufacturing method thereof. Background technique [0002] FIG. 9 is a schematic diagram showing a typical conventional condenser microphone. [0003] As shown in Figure 9, this typical condenser microphone (10) comprises: casing (11), and it is made of cylindrical metal, and the front plate of this casing (11) is formed with sound hole (11a); (PolarRing) (12), which is formed of conductive material; vibrating membrane (13); spacer (14); ring-shaped first base (15) (also called "insulating base"), which is formed of insulating material; back plate (16), which is opposed to the vibrating plate (13) (14) with a spacer; the second base 17 (also known as "conductive base"), which is formed from a conductive material; and PC...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R31/006
Inventor 朴成灏鲁宽旭
Owner BSE CO LTD