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Configurable polishing apparatus

A kind of technology of equipment and polishing head, which is applied in the direction of grinding/polishing equipment, metal processing equipment, surface polishing machine tools, etc., and can solve the problems that the three-step continuous CMP process cannot be performed.

Inactive Publication Date: 2008-01-30
康米可技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a CMP setup with two polishing stations arranged in series (which is designed for a two-step continuous CMP process) cannot perform a three-step continuous CMP process

Method used

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  • Configurable polishing apparatus
  • Configurable polishing apparatus
  • Configurable polishing apparatus

Examples

Experimental program
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Embodiment Construction

[0020] Referring to Fig. 1, a polishing apparatus 1 according to an embodiment of the present invention is described. The polishing apparatus 1 includes: polishing platforms 30a and 30b, loading and unloading tables 40a, 40a', 40b, 40b', 40c and 40c', polishing heads 51a, 51a', 51b and 51b'; and a frame structure 3, the frame structure 3 It is roughly represented as a rectangle in FIG. 1 . Polishing platforms 30a and 30b, loading and unloading stations 40a, 40a', 40b, 40b', 40c and 40c' and polishing or carrier heads 51a, 51a', 51b and 51b' are directly or indirectly attached to frame structure 3. The frame structure 3 is described in more detail below with reference to FIGS. 3 and 4 .

[0021] As shown in Figure 1, the polishing platforms 30a and 30b and the loading and unloading stations 40a, 40a', 40b, 40b', 40c and 40c' are attached to the frame structure 3 such that the first polishing platform 30a is located between the first and second loading and unloading stations 40...

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PUM

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Abstract

A constructional polishing equipment, including: main polishing structure, which comprises a plurality of polishing platforms, a plurality of polishing heads and a plurality of loading-unloading platforms; as well as an additional polishing structure, which comprises superfluity polishing platform and superfluity polishing head. The additional polishing structure can be jointed to the main polishing structure so as to form a larger polishing structure which is arranged with the superfluity polishing platform and the superfluity polishing head.

Description

technical field [0001] The present invention relates generally to semiconductor processing equipment, and more particularly to a polishing apparatus. Background technique [0002] Chemical mechanical polishing (CMP) processes are widely used for planarization during semiconductor device fabrication. In general, a CMP process involves polishing the surface of a semiconductor wafer on a polishing surface (eg, a polishing pad) using a solution (eg, a slurry solution) provided between the wafer surface and the polishing surface. Depending on the CMP process, multiple CMP steps may be performed to produce a single planarization layer on the semiconductor wafer. For example, multiple CMP steps may be performed on copper damascene structures during semiconductor device fabrication. [0003] To facilitate multi-step CMP processes, CMP equipment with multiple polishing stations has been developed. A problem with conventional CMP equipment is that each CMP equipment can only perfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/00H01L21/304B24B41/04B24B49/16
Inventor 丁寅权贝克史特斯尔·E·大卫
Owner 康米可技术股份有限公司