Combination method of heat radiation body and thermal pipe and its combination structure

Abstract

The invention provides a combination method of a heating body and a heat tube as well as a combination structure thereof, which are used for improving the efficiency of heat conduction; the combination structure consists essentially of the heating body and the heat tube; the central position of the heating body is provided with a perforating groove used for accommodating the heat tube, a plurality of perforating gaps correspondingly extend outside the circumference of the perforating groove, the other side of the perforating gap is connected with a perforation so as to arrange a jig in the perforating gap. Both the perforating gap and the circumference of the perforating groove are opened, which makes sure that the internal marginal diameter of the perforating groove is larger than the heat tube, and the heat tube is arranged in the perforating groove in a perforating way; at last, the jig is removed so as to ensure that the internal wall surface of the perforating groove can be tightly attached to the peripheral surface of the heat tube; thus optimal heat-conduction efficiency between the heat tube and the heating body can be attained.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation structure with a heat pipe. Background technique [0002] Driven by technology and new materials, the electronic products currently produced not only have more and more diversified functions, but also their volume is becoming lighter. Therefore, while electronic products are pursuing light weight and endowed with high performance, The heat generated by electronic products is equally astonishing. Since the heat generated by electronic products will directly affect the operation and service life of electronic products, heat dissipation management has become an important key to the development of the current electronic industry. [0003] The heat dissipation device with heat pipe is a common means of heat dissipation at present. This structure mainly includes heat pipe and radiator. And capillary tissue to absorb the heat generated by electronic components, and then c...

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Problems solved by technology

[0004] Although this heat dissipation method has the above-mentioned advantages, due to the unavoidable gap between the heat pipe and the heat sink in the prior art during the assembly process, the conduction between the heat pipe and the heat sink is greatly affected, and directly affects the overall heat dissipation device. Therefore, in order to solve the above-mentioned gap problem, the existing technology was improved to coat the outer surface of the heat pipe with a heat-conducting medium with heat-conducting properties, such as heat-conducting glue, to fill the gap between the heat pipe and the radiator when assembling. The resulting gap improves heat conduction between the two

[0005] However, there are still some defects in the effect of filling the gap with the heat-conducting medium. Since the heat-conducting medium is in a liquid state when coated on the heat pipe, it is easy to be scraped off when the heat pipe is connected to the heat sink, and the filling effect cannot be achieved. It is even easy to cause environmental pollution, and it is a waste of cost

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