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Method for bonding work pieces and micro-structured component

A microstructure and bonding technology, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of impossible production, inability to obtain reliable and stable joints, high costs, etc., and achieve high mechanical strength and corrosion resistance Performance, reliability and ease-of-use, easy-to-achieve effects

Inactive Publication Date: 2010-10-27
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0028] The following problem arises with brazing or diffusion welding: If, according to the prior art, the bonding temperature is lowered by supplying one of the elements boron, phosphorous or silicon according to its corresponding phase diagram, due to the formation of brittle phases , cannot obtain a reliable and stable joint
If such an adhesive layer with a small coating thickness is applied to the bonding area, this involves very high costs and is practically impossible in production according to M.G. Nicholas as stated above

Method used

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  • Method for bonding work pieces and micro-structured component
  • Method for bonding work pieces and micro-structured component
  • Method for bonding work pieces and micro-structured component

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Embodiment Construction

[0099] Figure 16 for passing with and without NiP x A bar graph comparing the tensile strength of columnar specimens bonded by sandwich (0.5h / 1000°C / approximately 10MPa);

[0100] Figure 17 for passing with and without NiB x Bar graph comparing tensile strength of sandwich bonded (4h / 700°C / ca. 10MPa) cylindrical specimens.

[0101] A. Test conditions:

[0102] a. Substrate and sample design:

[0103] In principle, the bonding method of the invention allows the bonding of a large number of metals and metal alloys. For example, the bonding method is carried out with the following materials: stainless steel (Material No. 1.4404) and 3220HT (Material No. 1.4876). In order to screen process parameters, a 2 Cylindrical specimens of the area to be soldered / brazed (diameter of the circular bonding area: 5 mm). The shape of these test pieces is modeled after that of small-scale test pieces according to DIN EN 10 002 part 1. figure 2 A schematic side view of the sample is ...

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Abstract

For forming very strong bond joints suited for manufacturing micro-structured components consisting of a plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.

Description

technical field [0001] The present invention relates to a method for bonding (or bonding) workpieces, in particular to a method for bonding layers of micro-structured elements suitable for the manufacture of micro-structured elements, said micro-structured elements Examples are elements with flow-guiding structures, such as microreactors, micromixers and microheat exchangers, and preferably elements made of metal, in particular nickel, nickel alloys and / or steel, especially stainless steel . The invention also relates to a microstructural element comprising stacked layers of microstructural elements joined together and preferably made of metal and / or metal alloys, in particular nickel, nickel alloys and / or Made of steel. Background technique [0002] For the fabrication of metal microstructured components, especially microreactors, micromixers and microheat exchangers, the thermal diffusion welding method has been used as a bonding technique for bonding metal foils. The s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K20/02
CPCF28F2260/02F28F2260/00F28F2275/04B23K20/023B23K20/02B23K20/227B23K20/22B23K20/00
Inventor H·迈尔O·屈茨R·赫贝尔C·马德里J·埃茨科恩T·瓦戈
Owner ATOTECH DEUT GMBH
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