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Enhanced encapsulation carrier board and its making method

A packaging carrier board and reinforced technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as unusability, damage and deformation of the package carrier board 100, and enhance the overall rigidity and avoid jamming. the effect of

Active Publication Date: 2011-07-13
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of the above package carrier 100 is that when the package carrier 100 is thinner and thinner due to needs, when the package carrier 100 is transported between machines, the package carrier 100 will be too soft to The situation of jamming occurs, so that the package carrier 100 is damaged and cannot be used
In addition, during the process of die bonding and wire bonding, the package carrier 100 needs to be heated to facilitate the process. However, when the package carrier 100 is too thin, the heating will cause the package carrier 100 to warp or deform, affecting the package. Process Manufacturability and Yield

Method used

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  • Enhanced encapsulation carrier board and its making method
  • Enhanced encapsulation carrier board and its making method
  • Enhanced encapsulation carrier board and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] refer to Figure 2a And 2b, the manufacturing method of the reinforced packaging carrier board of the present invention first provides a carrier board 200, such as a lead frame or a substrate, and the substrate can be, for example, a rectangular substrate strip (substrate strip) with a thickness of 0.2 mm or less. , a plurality of substrate units 210 are defined thereon. The package carrier 200 includes an upper surface 202 , such as the crystal mounting surface of the package carrier 200 , a lower surface 204 , such as the back side of the package carrier 200 , and a plurality of sides 206 connecting the upper and lower surfaces 202 , 204 . In addition, a chip placement area 230 is defined in each substrate unit 210 on the upper surface 202 of the package carrier 200 .

[0034] Next, refer to Figure 3a to 3d, on the edge region 202a of the upper surface 202 of the package carrier 200, or on the edge region 204a of the lower surface 204, or on the two edge regions 20...

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PUM

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Abstract

The invention provides a reinforced encapsulating support plate and a manufacturing method thereof. A supporting frame made by a sealing glue body is formed on the edge area of the upper surface of the encapsulating support plate and / or the edge area of the lower surface, thereby reinforcing the mechanical strength of the encapsulating support plate. The reinforced encapsulating support plate comprises an encapsulating support plate and a first glue encapsulating body, wherein, the encapsulating support plate comprises a first surface, a second surface corresponding to the first surface and aplurality of lateral surfaces for connecting the first surface and the second surface, and the first surface comprises at least a chip placing area and an edge area except the chip placing area; the first glue encapsulating body is formed on the edge area of the first surface of the encapsulating support plate through a mold encapsulating technique, thereby reinforcing the mechanical strength of the encapsulating support plate.

Description

technical field [0001] The present invention relates to a package carrier and its manufacturing method, as well as a semiconductor package structure manufacturing method, more particularly to a reinforced package carrier and its manufacturing method, and the semiconductor package structure using the above-mentioned reinforced package carrier Manufacturing method. Background technique [0002] refer to figure 1 , the known packaging carrier 100 is provided with one to several packaging units 110 , and the outer periphery of the packaging carrier 100 has an edge area 120 for transportation, positioning, pressing and other processes during the packaging process. However, the disadvantage of the above package carrier 100 is that when the package carrier 100 is thinner and thinner due to needs, when the package carrier 100 is transported between machines, the package carrier 100 will be too soft to Jamming occurs, so that the package carrier 100 is damaged and cannot be used. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/56H01L23/498H01L21/48H01L21/60H01L21/50H01L23/13
CPCH01L24/97H01L2924/15311H01L2224/97H01L2224/73265H01L2224/48227H01L2224/32225H01L24/73
Inventor 郑仁义陈光雄许俊宏
Owner ADVANCED SEMICON ENG INC