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Soldering method, semiconductor module manufacturing method and soldering apparatus

A soldering and soldering technology, applied in semiconductor/solid-state device manufacturing, semiconductor device, printed circuit manufacturing, etc., can solve problems such as complex structure and complex structure

Inactive Publication Date: 2008-12-03
TOYOTA IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure becomes complicated due to the need to set multiple pins
Especially when multiple electronic components are soldered on the substrate, the structure becomes more complicated

Method used

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  • Soldering method, semiconductor module manufacturing method and soldering apparatus
  • Soldering method, semiconductor module manufacturing method and soldering apparatus
  • Soldering method, semiconductor module manufacturing method and soldering apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012]

Below, refer to figure 1 ~ Fig. 6 illustrates the first embodiment of the present invention.

Such as figure 1 As shown, a semiconductor module 10 is provided with a circuit substrate 11 and a plurality of semiconductor elements 12 as electronic components. The plurality of semiconductor elements 12 are bonded to the circuit board 11 by soldering.

The circuit substrate 11 is provided with a plurality of (six in this embodiment) ceramic substrates 14 . A metal circuit 13 is provided on the surface of each ceramic substrate 14 . Four semiconductor elements 12 are soldered to each ceramic substrate 14 . On each ceramic substrate 14 , at least three semiconductor elements 12 are provided in a non-aligned state.

[0013]

Such as figure 2 As shown, the circuit substrate 11 includes: a ceramic substrate 14 with a metal circuit 13 on the surface; and a metal radiator 15 fixed on the ceramic substrate 14 by a metal plate 16 . That is, the circuit substrate 11 is a c...

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PUM

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Abstract

Provided is a soldering method for soldering an electronic component on a circuit board. The soldering method is provided with a step of placing an electronic component (12) on a bonding section (13) on a circuit board (11) through a solder (H), a step of placing a spindle (35) on the electronic component, and a step of heating and melting the solder while pressing the electronic component toward the circuit board by the spindle. The spindle is separated from the electronic component during a period from a time when the molten solder is wet spread between the bonding section and a bonding plane of the electronic component to a time when the temperature of the solder is high after the molten solder is solidified.

Description

technical field [0001] The present invention relates to a soldering method, a semiconductor module manufacturing method, and a soldering device. Background technique [0002] When mounting electronic components such as semiconductor elements, chip resistors, and chip capacitors on a circuit board, a method of joining the circuit board and the electronic components with solder is generally used. When soldering electronic components on a circuit board, when the solder between the electronic component and the circuit board melts, the position of the electronic component may shift due to the surface tension of the melted solder, or the solder may not spread over the entire joint surface of the electronic component conditions for ground bonding of electronic components. [0003] As a method for suppressing such a problem, there are methods disclosed in Patent Documents 1 and 2, for example. Patent Document 1 proposes a method of pressing the electronic component against t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H01L21/52
CPCH05K2203/163H01L2924/01023H01L2924/0105H01L2924/01082H01L2224/97H01L2924/09701H01L2924/01029H01L2224/83801H01L2924/19041H01L2224/83H05K3/3494H01L2924/014H01L2924/01013H01L2224/29101H01L2224/32225H01L25/50H05K2203/159H01L24/95H01L2924/19043H05K2203/101H05K2203/0278H05K3/0061H01L24/83H01L2924/19042H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H05K1/0269H05K3/341H05K1/0306H01L25/072H01L2224/83951H01L24/75H01L2924/13055H01L2924/1305H01L2924/15787H01L2224/75704Y02P70/50H01L2924/00H05K3/34H05K13/04
Inventor 金原雅彦
Owner TOYOTA IND CORP