Sensors for dynamic detection of damage and misalignment of moving substrates
A sensor and substrate technology, applied in the direction of testing moving boards, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of reduced production of process systems, broken substrates, and reduced output of process systems
Active Publication Date: 2016-01-20
APPLIED MATERIALS INC
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Problems solved by technology
Therefore, the robot arm in the transfer room is limited to a single-arm robot arm, which results in a reduction in the output of the process system
Another limitation that also reduces the throughput of the process system is that the substrate must be immobilized while it is over the four sensors during the sensing alignment process
Yet another limitation is that at least four sensors are required to detect the alignment of a single substrate
Finally, another limitation is that the four sensors only detect substrate defects (eg, substrate chips) at the corners of the substrate
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[0038] In one example, when the substrate supported on the end-effector of the dual-arm robotic arm passes through two E3C-LR11 In the case of laser sensors, the laser sensors are used to sense the movement of the substrate along two parallel edges of the substrate, and the laser sensors have a beam diameter of less than about 0.8 millimeters and are located at a working distance of about 1000 millimeters (i.e., less than about 40 inch working distance). Defects with a size of about 3 mm or larger can be detected when the substrate transport speed is about 1000 mm / s. The center of the illumination beam from the sensor was located at a distance of about 3 mm inward from the edge of the substrate. Defects with a size of about 1 mm or larger can be detected when the substrate transport speed is about 100 mm / s, and defects with a size of about 10 mm or larger when the substrate transport speed is about 2000 mm / s defects can be detected. Accordingly, the two illumination beams ...
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Abstract
The present invention provides an apparatus and method that utilizes at least two sensors (140A, 140B) to detect substrate defects, such as damaged or misaligned ones, along the length of at least two parallel edges of a moving substrate. exist. In one embodiment, the apparatus includes a sensor arrangement that senses the substrate at least two parallel edges of the substrate to detect substrate defects. In another embodiment, the apparatus comprises: a robotic arm (114 or 130) having a substrate support surface; and a sensor arrangement positioned at least two parallel edges of the substrate to sense the substrate to detect substrate defects.
Description
technical field [0001] Embodiments of the present invention generally relate to an apparatus and method for detecting substrate damage and misalignment of a moving substrate in a continuous and cost-effective manner. Background technique [0002] Substrate processing systems are used to process substrates such as silicon wafers for the production of integrated circuit components and glass panels for the production of flat panel displays. Usually, one or more robotic arms (robots) are installed in the substrate processing system to transfer the substrate in several processing chambers to perform a series of production process steps. In general, a substrate processing system includes a cluster tool having a centrally located transfer chamber with a transfer chamber robot disposed within the transfer chamber and several process chambers surrounding the transfer chamber. The transfer chamber is sometimes coupled to a factory interface that houses a factory interface robot and a...
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IPC IPC(8): G01N21/86
CPCG01N21/9501H01L21/67259H01L21/67288G01N21/9503G01N2021/95638
Inventor W·A·巴格利P·李K-T·金S-K·金T·基约塔克S·金T·松本J·E·拉森M·吉纳佳瓦J·霍夫曼B·C·梁
Owner APPLIED MATERIALS INC