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Gold thread break detection apparatus of full-automatic lead bonding machine

A technology for wire bonding and wire breakage detection, which can be used in measuring devices, measuring electricity, measuring electrical variables, etc., and can solve problems such as poor bonding strength

Inactive Publication Date: 2012-07-11
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a gold wire break detection device for automatic wire bonding machines that can automatically detect whether there are problems such as broken wires, poor bonding strength, and too short wire tails.

Method used

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  • Gold thread break detection apparatus of full-automatic lead bonding machine
  • Gold thread break detection apparatus of full-automatic lead bonding machine
  • Gold thread break detection apparatus of full-automatic lead bonding machine

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Embodiment Construction

[0017] Depend on Figure 1-3 It can be known from the shown embodiment that this embodiment consists of a central processing unit, an IO interface circuit, an RS422 interface circuit, a signal source generator, a programmable voltage source, a buffer amplifier BF1, a sampling circuit, a differential amplifier, a linear rectification circuit, a comparator, Buffer BF2, a digital processing circuit, and a short circuit detection circuit; the central processing unit is bidirectionally connected to the IO interface circuit and the RS422 interface circuit, and the output terminal of the signal source generator is connected to the input terminal of the programmable voltage source, which can be programmed The voltage source is bidirectionally connected to the central processing unit. The first output of the programmable voltage source, that is, the AC signal voltage, is connected to the input end of the buffer amplifier BF1. One output of the buffer amplifier BF1 is connected to an inp...

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Abstract

The invention relates to a device for detecting gold lead breakage of a full automatic lead bonding machine, which is suitable for the device of omnidistance on-line detecting in the course of automatically welding lead of the full automatic lead bonding machine and so on semiconductor devices. The invention is composed of a central processing unit, an IO interface circuit, a RS422 interface circuit, a signal source generator, a programmable voltage source, a buffer amplifier BF1, a sample circuit, a differential amplifier, a linear rectification circuit, a comparator, a buffer BF2, a digitalprocessing circuit, a short circuit detecting circuit. The invention can automatically detecting whether the problems of lead break, poor bonding strength, over short lead end and so on which do not satisfy bonding process requirements are found, in order to remind operator to find problems in time, thereby modifying the process parameters to satisfy the process requirements.

Description

technical field [0001] The invention relates to a gold wire breakage detection device for a fully automatic wire bonding machine, which is suitable for the whole process of online detection during the automatic wire bonding process of semiconductor equipment such as a fully automatic wire bonding machine. Background technique [0002] The fully automatic wire bonding machine uses thin metal wires (generally, the diameter of the gold wire is between 25 microns and 50 microns) to connect the gold wire to the chip pad (called the first solder joint), and then connect the gold wire to the lead frame (called the second pad) semiconductor-specific equipment. The wire break detection device is one of the key technologies. Several companies that produce wire bonding machines in the world regard this technology as a secret and render it as a major feature in the product description. After searching, no technical information identical with the present application has been found so fa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/02
Inventor 谢珺耀谢秀镯
Owner THE 45TH RES INST OF CETC
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