System with a connection device and at least one semi-conductor construction element
A connecting device and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, etc., can solve the problem of poor adhesion of conductive films, uneven adhesion of fillers to conductive films, and conductivity Or insulation capacity power semiconductor module function damage and other issues
Inactive Publication Date: 2009-04-15
SEMIKRON ELECTRONICS GMBH & CO KG
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Problems solved by technology
[0008] The disadvantage here is that the filler usually adheres unevenly to the conductive film during the underfill process and is in principle less adherent to the conductive film than to the power semiconductor components
[0009] Furthermore, it is disadvantageous that the power semiconductor components are generally sensitive to mechanical forces in each connecting device
If such force effects lead to damage to the power semiconductor components, the electrical conductivity or insulation from the power semiconductor components and the function of the power semiconductor modules are impaired
Method used
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[0024] FIG. 1 shows in cross section the structure according to the invention with a connecting device 1 designed as a composite film 10 , 12 , 14 and components 3 a / b, 4 , 5 . The composite film consists of at least one insulating film 14 and two conductive films 10 , 12 and has the following layer structure: starting with a conductive film 10 , followed by the insulating film 14 and the conductive film 12 respectively. At least one electrically conductive film is formed 18 and thus forms electrically conductive tracks 100 , 120 insulated from one another.
[0025] The power semiconductor components 3a, 3b arranged on the conductive lines 100, 120 of the first conductive film 10 are here a power diode 3b and a power transistor 3a, but are not meant to be limited to these components. These power semiconductor components 3 each have at least one contact surface 32 on their side facing the connecting device 1 . To form a connection between the first electrically conductive film...
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A connecting structure comprising a connecting device for electrically conductive connection to at least one semiconductor component and a filler. The connecting device is a film composite comprising at least two electrical films with an insulating film therebetween. The electrically conductive films are inherently structured and thus form conductor tracks. At least one semiconductor component is assigned to at least one cutout in the respective conductive film, wherein the filler is situated between the connecting device and the assigned semiconductor component.
Description
technical field [0001] The invention relates to a structured, preferably compact, power semiconductor module with a connecting device designed as a composite film for electrically conductive connection to at least one power semiconductor component and a drive module, wherein the connection between the power semiconductor component and the connecting device There is a filler between the conductive lines. Background technique [0002] For contacting unencapsulated semiconductor components, so-called "flip-chip mounting" is known, in which the semiconductor components are connected directly and without further connectors with an electrically conductive contact surface to the conductive lines of the circuit carrier superior. This contact is usually made by means of contact bumps. The space remaining between the power semiconductor component and the conductive line is filled with a low-viscosity filler for the purpose of electrical insulation, which is customarily called "capil...
Claims
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IPC IPC(8): H01L23/498H01L23/538
CPCH01L23/13H01L2224/48472H01L23/49822H01L24/48H01L2224/83385H01L2924/00014H01L2224/45099H01L2224/45015H01L2924/207H01L21/77
Inventor K·奥古斯丁C·格布尔
Owner SEMIKRON ELECTRONICS GMBH & CO KG