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Device for forming alignment mark on back surface, and method for forming alignment mark

A technology of alignment marks and alignment marks, which is applied to the exposure device of photo-engraving process, photo-engraving process of pattern surface, instruments, etc., can solve the problems of difficult detection of alignment marks by optical analysis equipment, etc., so as to improve pixel performance. , the effect of reducing the coverage error

Inactive Publication Date: 2010-06-09
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, such alignment marks are covered by opaque materials in later processing steps, thus making them difficult to detect by optical analysis equipment

Method used

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  • Device for forming alignment mark on back surface, and method for forming alignment mark
  • Device for forming alignment mark on back surface, and method for forming alignment mark
  • Device for forming alignment mark on back surface, and method for forming alignment mark

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Embodiment Construction

[0068] The ensuing disclosure provides several different implementations, or examples of implementing features of various implementations. The following briefly describes the present disclosure using several preferred embodiments. These are just some preferred examples, and are not intended to limit the scope of the present disclosure. In addition, this disclosure will repeatedly use some numbers or nouns in various examples. The purpose of repeated use is to make the description simpler and clearer, and does not mean that there is a close correlation between the various embodiments or settings. In addition, a second feature adopts some descriptions on a first feature may indicate that the first and second features have something in common, but it may also be in some embodiments because additional features are added to the second feature feature makes it very different from the first feature.

[0069] refer to Figure 1A , which is a partial flowchart of a method 100 accord...

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Abstract

The invention relates to a device of forming an alignment mark at backside, comprising an integrated circuit and an alignment mark, characterized in that the integrated circuit is located in a first region of a substrate having first and second opposing major surfaces; and the alignment mark is located in a second region of the substrate and extends through the substrate between the first and second surfaces. Furthermore, the alignment mark may protrude from the first and / or second surfaces, and / or may comprise a plurality of substantially similar alignment marks. The second region may interpose the first region and a perimeter of the substrate and may comprise a scribe region. The invention further claims a method of forming an alignment mark at backside.

Description

technical field [0001] The present invention relates to an apparatus and method for alignment, and more particularly to an apparatus and method for forming alignment marks on a back surface. Background technique [0002] In fabricating an integrated circuit, it is important to align each patterned layer with previously formed layers, at least within some acceptable tolerance. For example, a substrate coated with photoresist is placed in a photolithography chamber (such as a stepper or scanner) to pattern the various layers. Then, the photoresist is patterned with a photomask. Since the patterned photoresist is extremely required to be placed in the position of the underlying etched circuit layer, the position of the circuit layer needs to be aligned very precisely. [0003] For another example, in order to align the substrate with the photomask, an optical analysis device is used to compare the image of a certain structure on the photomask with a certain structure on the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L21/00G03F7/20G03F9/00
CPCH01L2924/0002H01L23/544H01L2223/54453H01L2223/54426H01L21/71H01L2223/5446H01L2924/3011H01L2924/00
Inventor 刘人诚杨敦年伍寿国
Owner TAIWAN SEMICON MFG CO LTD