Supercharge Your Innovation With Domain-Expert AI Agents!

heat sink

一种散热器、散热片的技术，应用在电固体器件、半导体器件、冷却/通风/加热改造等方向，能够解决安全隐患、划伤其他元件等问题

Active Publication Date: 2011-12-28
STATE GRID CORP OF CHINA +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such heat sinks are generally made of thin metal sheets with relatively sharp edges, especially the sharp edges and corners of the heat sink, which can easily scratch other components or related operations and processes during production, transportation, assembly, and use. users, thus forming a certain safety hazard

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • heat sink
  • heat sink
  • heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The radiator of the present invention is used to dissipate heat from heating electronic components such as a central processing unit (not shown in the figure).

[0013] like figure 1 and 2 As shown, the radiator of the present invention can be installed directly on the heating electronic components, or can be installed on a base (not shown) in contact with the heating electronic components.

[0014] The above-mentioned heat sink includes a plurality of cooling fins 10 that are interlocked together. Each cooling fin 10 includes a large rectangular body and a flange 11 extending vertically to the same side from the upper and lower edges of the body. All the cooling fins 10 When combined together, the folded edges 11 of the upper and lower ends respectively form two planes that can contact the surface of the base or the top surface of the heating electronic component. The heat sink 10 is respectively provided with two first fastening structures spaced apart from each oth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A heat sink, comprising a plurality of heat sinks, the upper and lower edges of the heat sinks are formed with folded edges, and the heat sinks are provided with fastening structures that are interlocked so that the upper and lower folded edges form two planes respectively, each of the heat sinks All corners are curved. The arc surfaces corresponding to each corner of the heat sink form a cylindrical surface connected to the two ends of the two planes and extending inwards of the heat sink. The folded edges of the upper and lower edges of the heat sink form two continuous planes, and the arc surface at the corner of the heat sink forms a cylindrical surface connected to the two ends of the two planes and curved into the heat sink, so that the heat sink can be combined The heat sink formed together has no exposed sharp edges and corners, so the heat sink does not have the hidden danger of easily scratching related components and users during installation, transportation and use.

Description

technical field [0001] The invention relates to a heat sink, in particular to a heat sink applied to electronic components. Background technique [0002] With the rapid development of the electronics industry, the running speed of electronic components such as microprocessors is getting faster and faster. However, the high-frequency and high-speed operation will inevitably increase the heat generated rapidly. If the heat is not dissipated in time, it will cause The temperature rises sharply, which seriously affects the stability and performance of electronic components. On the other hand, due to the continuous advancement of large-scale integrated circuit technology, the size of electronic heating components such as microprocessors is also getting smaller and smaller, which will make electronic components The heat generated by the high-speed operation of components is more difficult to dissipate. At present, the problem of heat dissipation has become a major obstacle to the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/367H01L23/40
CPCH01L23/3672H01L2924/0002H01L2924/00
Inventor 李武吴宜强陈俊吉
Owner STATE GRID CORP OF CHINA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com