Compound copper powder for manufacturing capillary structure of inner wall of heat pipe

Abstract

The invention provides compound copper powder for manufacturing a capillary structure inside a heat pipe, which is a mixture consisting of copper powder and pore-forming agent powder. The compound copper powder ensures that a more favorable capillary structure layer can be produced under the condition of not changing the conventional heat pipe manufacturing process. The compound copper powder obtained by the invention is ram-jolted and sintered and then is prepared into the capillary structure layer with high porosity; and the effective porosity and the through hole ratio thereof are greatly improved compared with that of ordinary copper powder, and the permeability is also greatly improved compared with that of materials fired by the ordinary copper powder, which greatly improves the heat transfer efficiency of the heat pipe.

Description

technical field [0001] The invention relates to a composite copper powder, which is used for manufacturing the capillary structure of the inner wall of a heat pipe. The heat pipes include ordinary sintered heat pipes, composite heat pipes, loop heat pipes (Loop heat pipes), flat heat pipes (Vapor chamber), etc., and can be applied to the fields of aerospace, electrical, electronic and mechanical. Background technique [0002] In recent years, with the rapid development of aerospace, electrical and electronic fields, especially the rapid development of semiconductor manufacturing and electronic packaging technology, the working efficiency of electronic and electrical components has been greatly improved. However, while the components are working rapidly, the heat consumption is also increasing greatly, and the working life and working stability of the components are also severely restricted. will be reduced by 50%; when the operating temperature of the motor rises by 20°C, i...

AI Technical Summary

Problems solved by technology

Due to its complicated process, it is not suitable for the production of heat pipes, and the porosity of the capillary structure layer and the heat conduction effect of heat pipes are not mentioned.

[0009] Chinese patent 200610156330.5 also proposes a method for preparing a high-porosity metal porous carrier material, but the sintering process requires multi-stage heat preservation, which is used for the adsorption storage of special substances and catalyst carriers, and the thermal conductivity is unknown

Not suitable for making heat pipes

Images