Low-temperature co-fired ceramic medium material and preparation method thereof

A technology of low-temperature co-fired ceramics and dielectric materials, which is applied in the field of ceramic dielectric materials and their preparation, and can solve problems such as high loss, narrow range of adjustable sintering shrinkage, and low dielectric constant.
CN101823877BInactive Publication Date: 2012-07-04TIANJIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN UNIV
Publication Date
2012-07-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a low-temperature co-fired ceramic medium material. The material consists of 1 to 16 weight percent of glass powder and 84 to 99 weight percent of Ba6-3x(Nd0.4Bi0.6)8+2xTi18O54, wherein the x is 0.5 to 1.5. The glass powder is at least one of the following two types of glass powder, namely glass powder B consisting of 30 to 50 mass percent of Li2CO3 and 5 to 20 mass percent of SiO2 and 40 to 60 mass percent of H3BO3 and glass powder C consisting of 15 to 40 mass percent of LiF and 60 to 85 mass percent of BaF2. In a preparation process, first, clinker is prepared; then, secondary preparation of the glass powder and the clinker is performed; and finally, sintering is performed. A BaO-Nd2O3-Bi2O3-TiO2 system is selected and a method of adding the glass powder as a sintering aid is adopted, so the material has the characteristics of sintering temperature below 900 DEG C, high dielectric constant and low dielectric loss, simultaneously has a wide sintering shrinkage range, and can be co-fired with a silver metallic electrode with high conductivity.
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Description

technical field

[0001] The invention relates to a ceramic dielectric material and a preparation method thereof, more specifically, to a low-temperature co-fired ceramic dielectric material and a preparation method thereof. Background technique

[0002] The development of information technology requires high-speed data and high current density transmission, and electronic circuits are increasingly developing in the direction of miniaturization, integration and high frequency. This puts forward requirements for electronic components with small size, high frequency, high reliability, low price and high Integration requirements. In recent years, low-temperature co-fired ceramics (LTCC) technology has brought great flexibility to the design of multilayer circuits and electronic components, and has become a research hotspot.

[0003] Since this technology requires different dielectric materials (such as capacitors, substrates, etc.), magnetic dielectric materials (such as inducto...

Claims

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