The present invention relates to the field of
semiconductor technology. To solve the problems of nano-
copper oxidation and
sintering shrinkage in the prior art, a composite
copper powder, a preparation method thereof, a
semiconductor package, and a preparation method thereof are provided. The preparation method of the composite
copper powder comprises the following steps: weighing soluble
copper salt and a pore-forming agent, dissolving them in a first alkaline solution, and mixing uniformly to obtain a first solution; weighing a
reducing agent and a dispersant, dissolving them in a second alkaline solution to obtain a second solution; quickly mixing the first solution and the second solution under stirring and reacting, cooling to
room temperature after the reaction ends, performing
solid-liquid separation to obtain copper particles; adding the copper particles into a
solvent, mixing uniformly, adding a
coating agent, and stirring, performing
solid-liquid separation and
vacuum drying to obtain micron copper; weighing micron copper and
nano copper, the
mass ratio of micron copper to
nano copper being (1 to 81):9, mixing the micron copper and the
nano copper, and embedding the nano copper into the concave points of the micron copper to obtain the composite copper
powder.