The invention relates to the technical field of semiconductors, and provides composite
copper powder, a preparation method of the composite
copper powder, a
semiconductor packaging piece and a preparation method of the
semiconductor packaging piece in order to solve the problems of nano-
copper oxidation and
sintering shrinkage in the prior art. The preparation method of the composite copper
powder comprises the following steps: weighing soluble
copper salt and a pore-forming agent, dissolving the soluble
copper salt and the pore-forming agent in a first alkaline solution, and uniformly mixing the soluble
copper salt and the pore-forming agent to obtain a first solution; a
reducing agent and a dispersing agent are weighed and dissolved in a second alkaline solution, and a second solution is obtained; quickly mixing the first solution and the second solution under stirring, reacting, cooling to
room temperature after the reaction is finished, and carrying out
solid-liquid separation to obtain copper particles; the preparation method comprises the following steps: adding copper particles into a
solvent, uniformly mixing, adding a
coating agent, stirring, carrying out
solid-liquid separation, and carrying out
vacuum drying to obtain micron copper; and micron copper and
nano copper are weighed, the
mass ratio of the micron copper to the
nano copper is (1-81): 9, the micron copper and the
nano copper are mixed, the nano copper is embedded into the concave points of the micron copper, and the composite copper powder is obtained.