A process for preparing lead-free glass powder used for electronic paste, which comprises: firstly uniformly mixing silicon dioxide or sodium silicate, barium oxide or barium carbonate, boron oxide or boric acid, bismuth oxide or bismuth sulfate, aluminum oxide, aluminum sulfate or aluminum silicate, zinc oxide or zinc carbonate, sodium oxide, sodium carbonate or sodium bicarbonate, potassium oxide or potassium carbonate and titanium dioxide, then heating the mixed raw materials to melt, cooling the melted mixture, then grinding into power by a ball grinder, sieving by a sieve of 100-400 eye and lastly drying glass powder to obtain the lead-free glass powder. Because the glass power of the invention does not contain lead oxide (PbO) or compounds of lead oxide (PbO), the invention is harmless in the manufacture process of paste, simultaneously is beneficial for environmental protection, and is convenient for recycling and reusing electronic product modules containing the electronic paste.