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Preparation method of leadless glass powder for electronic slurry

A technology of lead-free glass and electronic paste, applied in the field of preparation of lead-free glass powder, which can solve problems such as difficulty in recycling waste devices, easy reaction of lead, lead pollution, etc., to facilitate recycling and reuse, and to be beneficial to environmental protection Effect

Inactive Publication Date: 2008-07-09
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Similarly, the use of lead-containing glass powder in the production of electronic paste causes greater pollution in the production process, and lead is prone to react during the sintering process, and it is also difficult to recycle waste devices
More importantly, due to the pollution of lead to the environment, the method of using this material to manufacture electronic paste can no longer meet people's requirements for environmental protection.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: first by mass percentage, 8% silicon dioxide, 23.5% barium oxide, 20% boron oxide, 23% bismuth oxide, 6% aluminum oxide, 12.5% ​​zinc oxide, 3% oxide Sodium, 1.5% potassium oxide and 2.5% titanium dioxide are mixed evenly; the mixed raw materials are heated to melt, the melted mixture is cooled, and then ball milled into powder with a ball mill, and sieved through a 100-400 mesh sieve, and finally The glass powder is dried to obtain lead-free glass powder. Its density is 3.3×10 3 Kg / m 3 , the softening point is 586°C, and the current expansion coefficient is 8.34×10 -6 / °C, this lead-free glass powder can be used as an inorganic binder for lead-free electronic silver paste.

Embodiment 2

[0009] Embodiment 2: first by mass percentage by the silicon dioxide of 5%, the barium carbonate of 40%, the boric acid of 10%, the bismuth oxide of 35%, the zinc carbonate of 2%, the sodium carbonate of 3%, the potassium oxide of 5% Mix evenly; heat the mixed raw materials to melt them, cool the melted mixture, then use a ball mill to grind it into powder, and sieve through a 100-400 mesh sieve, and finally dry the glass powder to obtain lead-free glass powder.

Embodiment 3

[0010] Embodiment 3: first by mass percentage, 30% sodium silicate, 40% boron oxide, 10% bismuth sulfate, 2% aluminum sulfate, 7% zinc oxide, and 11% titanium dioxide are uniformly mixed; The final raw material is heated to melt, the melted mixture is cooled, and then ball milled into powder by a ball mill, and sieved through a 100-400 mesh sieve, and finally the glass powder is dried to obtain lead-free glass powder.

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PUM

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Abstract

A process for preparing lead-free glass powder used for electronic paste, which comprises: firstly uniformly mixing silicon dioxide or sodium silicate, barium oxide or barium carbonate, boron oxide or boric acid, bismuth oxide or bismuth sulfate, aluminum oxide, aluminum sulfate or aluminum silicate, zinc oxide or zinc carbonate, sodium oxide, sodium carbonate or sodium bicarbonate, potassium oxide or potassium carbonate and titanium dioxide, then heating the mixed raw materials to melt, cooling the melted mixture, then grinding into power by a ball grinder, sieving by a sieve of 100-400 eye and lastly drying glass powder to obtain the lead-free glass powder. Because the glass power of the invention does not contain lead oxide (PbO) or compounds of lead oxide (PbO), the invention is harmless in the manufacture process of paste, simultaneously is beneficial for environmental protection, and is convenient for recycling and reusing electronic product modules containing the electronic paste.

Description

technical field [0001] The invention relates to a preparation method of lead-free glass powder, in particular to a preparation method of lead-free glass powder for electronic paste. Background technique [0002] In recent years, with the rapid development of science and technology, the demand for electronic paste in the electronics industry is increasing, which also promotes the development of electronic paste preparation technology closely related to chemistry, physics, materials, engineering and other disciplines. improve dramatically. [0003] Generally speaking, the preparation of electronic paste mainly includes the preparation of functional phases such as metal and noble metal powders, the preparation of inorganic binders such as glass powder, the preparation of organic binders, etc. Here we mainly talk about inorganic binders, but also It is the preparation of glass powder. Generally, there are two types of glass: high-temperature glass and low-temperature glass. Hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C03C12/00
Inventor 张宇阳
Owner IRICO
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