Grout silver paste applied to thick film circuit

A thick film circuit and paste technology, applied in circuits, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve the problems of large sintering shrinkage, poor conductivity, and poor substrate adhesion.

Inactive Publication Date: 2010-10-27
IRICO
View PDF5 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the disadvantages of poor electrical conductivity of the above-mentioned existing paste, large sintering shrinkage, and poor adhesion to the substrate, and provide a silver paste for filling holes applied to thick film circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The silver powder uses spherical silver powder with an average particle size of 5 μm, and the bulk density of the silver powder is 5g / ml. Two kinds of glass frits are used, glass frit A (lead borosilicate glass, softening point is about 550 ℃), glass frit B (bismuth boron Silica-alumina glass, softening point is about 730°C), the organic vehicle is made of terpineol and ethyl cellulose at a ratio of 9:1. The above materials are weighed according to the following proportions:

[0017] Silver Powder 80%

[0018] Glass frit A 2%

[0019] Glass frit B 2%

[0020] Organic Vehicle 16%

[0021] After the weighing of the material is completed, it is manually stirred into a paste, and then rolled on a three-roll mill according to the slurry preparation process for more than 10 times to obtain the required slurry.

Embodiment 2

[0023] The conductive powder uses the silver powder and organic carrier in Example 1, glass frit A and glass frit C (bismuth borosilicate glass frit, softening point is about 680°C), and weighed according to the following ratio:

[0024] Silver Powder 77%

[0025] Glass frit A 3%

[0026] Glass frit B 1.5%

[0027] Organic Vehicle 18.5%

[0028] After the weighing of the material is completed, it is manually stirred into a paste, and then rolled on a three-roll mill according to the slurry preparation process for more than 10 times to obtain the required slurry.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
softening pointaaaaaaaaaa
softening pointaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses grout silver paste applied to a thick film circuit, which consists of 60 to 90 weight percent of conductive powder, 1 to 6 weight percent of frit and 10 to 35 weight percent of organic carrier, wherein the total weight of the conductive powder, the frit and the organic carrier is 100 percent. The conductive powder is the powder of gold, silver, palladium, copper, nickel, tungsten and manganese alloys or the mixed powder of the powder; and the grain diameter of the conductive powder is controlled to be 1 to 10mu m. The grout silver paste applied to the thick film circuit prepared by the invention has the characteristics of high electrical conductivity, low sintering shrinkage rate and good matrix matching performance and the using requirement of a grout process of the thick film circuit is met in the using process.

Description

technical field [0001] The invention belongs to the field of electronic paste, and relates to a hole-filling silver paste applied to thick-film circuits. Background technique [0002] Thick-film circuit is a passive network made on a substrate by screen printing and sintering processes, on which discrete semiconductor device chips or monolithic integrated circuits or micro-components are assembled, and then packaged to form a hybrid integrated circuit. It is a miniature electronic functional part. [0003] In ordinary thick-film circuits, single-sided printing is generally used to form a circuit network and mount chips and electronic components on one side of the substrate. The thick film circuit module formed in this way is usually relatively large, so in order to reduce the volume of the thick film circuit, sometimes double-sided printing is used, which requires the use of thick film silver paste for hole filling, and the use of thick film hole filling The silver paste f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01L23/488
Inventor 佟丽国
Owner IRICO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap