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Conductive paste composition for internal electrodes and multilayer ceramic electronic component including the same

A technology of electronic components and conductive paste, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, conductive coatings, etc., can solve the problems of internal electrode joint damage, internal electrical layer agglomeration or separation, etc.

Inactive Publication Date: 2013-01-09
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the internal electrical layer may be excessively sintered during sintering of the ceramic green sheet, and as a result, the internal electrical layer may be agglomerated or separated, and the bondability of the internal electrodes may be damaged.

Method used

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  • Conductive paste composition for internal electrodes and multilayer ceramic electronic component including the same
  • Conductive paste composition for internal electrodes and multilayer ceramic electronic component including the same
  • Conductive paste composition for internal electrodes and multilayer ceramic electronic component including the same

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Embodiment Construction

[0027] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the specific embodiments set forth herein. Rather, these specific embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the shapes and dimensions may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like components.

[0028] This invention relates to ceramic electronic components. The electronic components using ceramic materials may be capacitors, inductors, piezoelectric devices, varistors or thermistors. Next, a multilayer chip capacitor (hereinafter, also referred to as "MLCC") as an example of the electronic component will be described.

[0029] figure 1 is a sch...

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Abstract

There are provided a conductive paste composition for an internal electrode and a multilayer ceramic electronic component including the same. The conductive paste composition includes: 100 moles of a metal powder; 0.5 to 4.0 moles of a ceramic powder; and 0.03 to 0.1 mole of a silica (SiO2) powder. The conductive paste composition can raise the sintering shrinkage temperature of the internal electrodes and improve the connectivity of the internal electrodes, and can improve the degree of densification of the dielectric layer, thereby improving withstand voltage characteristics, reliability, and dielectric characteristics.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2011-0067438 filed with the Korean Intellectual Property Office on Jul. 7, 2011, the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a conductive paste composition for internal electrodes and a multilayer ceramic electronic component containing the conductive paste composition, more particularly, to a conductive paste composition for internal electrodes capable of controlling the sintering shrinkage of metal powder , and a multilayer ceramic electronic component containing the conductive paste composition. Background technique [0004] Generally, an electronic component using a ceramic material, such as a capacitor, an inductor, a piezoelectric device, a varistor, or a thermistor, includes a ceramic sintered body made of a ceramic material; an internal electrode layer formed in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01G4/008H01G4/30
CPCH01B1/16H01G4/30H01G4/12H01C7/10H01C7/13H01G4/008C09D5/24H01B1/02H01B1/06H01J17/04H01M4/02H05K1/092
Inventor 金钟翰金永浩郑贤哲
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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